Cooling Solution - Congatec conga-PA5 Manual

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Cooling Solution

congatec AG offers cooling solutions for the lidded (industrial) and open silicon (commercial) conga-PA5 variants:
• Passive cooling solutions (CSP)
• Heatspreader (HSP)
The dimensions of the cooling solutions are shown below. All measurements are in millimeters. The recommended torque for heatspreader
screws is 0.3 Nm. Mechanical system assembly mounting shall follow the valid DIN/ISO specifications.
The heatspreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some
modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers.
Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered
as a heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution. The application
specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions
may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.
Note
The gap pad material used on all heatspreaders contains silicon oil that can seep out over time depending on the environmental conditions
it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap pad material
manufacturer's specification.
Caution
The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the board is maintained at all times. This may require additional cooling components for your final application's thermal
solution.
For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the board. Apply thread-locking fluid on the
screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-threading,
use non-threaded carrier board standoffs to mount threaded cooling solutions.
For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without the
fixing post feature, the thermal stacks may move. Also, do not exceed the maximum torque specified for the screws. Doing so may damage
the board.
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