Fitting The Main-Board Assembly To The Chassis - Tait TM9100 Service Manual

The circled numbers in this section refer to the items in
Fitting the Main-
Board Assembly to
page
the Chassis
1.
2.
Important
3.
4.
TM9100 Service Manual
© Tait Electronics Limited August 2005
127. This figure shows the 50W/40W configuration.
With the 50W/40W radio, the L-shaped gap pad
each time the main-board assembly
Remove any residue of the old gap pad from the audio-PA area on
the underside of the main board (refer to
and the L-shaped ridge of the chassis (refer to
page 127).
Peel off the transparent film on one side of the gap pad and evenly
press the gap pad on the L-shaped ridge of the chassis.
Peel off the transparent film on other of the gap pad.
If the thermal paste on the heat-transfer block or the underside of the
main board has been contaminated, new thermal paste must be
applied:
Remove any residue of the old thermal paste from both contact
surfaces.
Use Dow Corning 340 silicone heat-sink compound
(IPN 937-00000-55).
Ensure that no bristles from the brush come loose and
remain embedded in the paste. The paste needs to be
completely free of contaminants.
Use a stiff brush to apply 0.1cm
transfer block (refer to
Use a stiff brush to apply 0.01cm
audio-PA heat sink of the chassis (refer to
Place the main-board assembly
Loosely screw in the two screws
hand.
Figure 5.3 on
1)
F
is removed from the chassis
Figure 5.6 on page
Figure 5.3 on
3
of thermal paste on the heat-
Figure 5.3 on page 127).
3
of thermal paste on the
Figure 5.3 on page
F
in position in the chassis
I
through the heat-transfer block by
Disassembly and Reassembly
must be replaced
G
:
131)
127)
G
.
133