Contents
1
Introduction ............................................................................................................ 11
1.1
Terminology ..................................................................................................... 12
1.1.1
1.2
References ....................................................................................................... 14
2
2.1
2.2
Decoupling Guidelines ........................................................................................ 15
2.2.1
VCC Decoupling ..................................................................................... 15
2.2.2
Vtt Decoupling ....................................................................................... 15
2.2.3
FSB Decoupling...................................................................................... 16
2.3
Voltage Identification ......................................................................................... 16
2.4
2.5
2.6
2.6.1
2.6.2
2.6.3
VCC Overshoot ...................................................................................... 25
2.6.4
2.7
2.7.1
FSB Signal Groups.................................................................................. 26
2.7.2
2.7.3
2.7.3.1
2.7.3.2
2.8
Clock Specifications ........................................................................................... 31
2.8.1
2.8.2
2.8.3
2.8.4
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Processor Materials............................................................................................ 40
3.8
Processor Markings............................................................................................ 40
4
4.1
4.2
5
5.1
5.1.1
5.1.2
Thermal Metrology ................................................................................. 82
5.2
5.2.1
Thermal Monitor..................................................................................... 82
5.2.2
Thermal Monitor 2 .................................................................................. 83
Datasheet
3