Thermal Specifications And Design Considerations; Processor Thermal Specifications; Thermal Specifications - Intel Q9300 - Core 2 Quad 2.5 GHz 6M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Datasheet

Thermal Specifications and Design Considerations

5 Thermal Specifications and
Design Considerations
5.1

Processor Thermal Specifications

The processor requires a thermal solution to maintain temperatures within the
operating limits as set forth in
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete thermal solution includes both component and system level thermal
management features. Component level thermal solutions can include active or passive
heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system
level thermal solutions may consist of system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the
appropriate Thermal and Mechanical Design Guidelines (See
Note: The boxed processor will ship with a component thermal solution. Refer to
for details on the boxed processor.
5.1.1

Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum case temperature (T
specifications when operating at or below the Thermal Design Power (TDP) value listed
per frequency in
thermal capability may affect the long-term reliability of the processor and system. For
more details on thermal solution design, refer to the appropriate Thermal and
Mechanical Design Guidelines (See
The processor uses a methodology for managing processor temperatures which is
intended to support acoustic noise reduction through fan speed control. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor's Platform Environment Control Interface (PECI) bus as described in
Section 5.3. If the value reported via PECI is less than T
temperature is permitted to exceed the Thermal Profile. If the value reported via PECI
is greater than or equal to T
at or below the temperature as specified by the thermal profile. The temperature
reported over PECI is always a negative value and represents a delta below the onset of
thermal control circuit (TCC) activation, as indicated by PROCHOT# (see
Systems that implement fan speed control must be designed to take these conditions in
to account. Systems that do not alter the fan speed only need to ensure the case
temperature meets the thermal profile specifications.
In order to determine a processor's case temperature specification based on the
thermal profile, it is necessary to accurately measure processor power dissipation. Intel
has developed a methodology for accurate power measurement that correlates to Intel
test temperature and voltage conditions. Refer to the appropriate Thermal and
Mechanical Design Guidelines (See
Datasheet
Section 5.1.1. Any attempt to operate the processor
Table 5-1. Thermal solutions not designed to provide this level of
Section
, then the processor case temperature must remain
CONTROL
Section
Section
1.2).
, then the case
CONTROL
1.2) for the details of this methodology.
1.2).
Chapter 7
)
C
Section 5.2).
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