Processor Component Keep-Out Zones; Package Loading Specifications; Package Handling Guidelines; Processor Loading Specifications - Intel Q9300 - Core 2 Quad 2.5 GHz 6M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Datasheet

Package Mechanical Specifications
3.2

Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See
out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
3.3

Package Loading Specifications

Table 3-1
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solutions.
.
Table 3-1.

Processor Loading Specifications

Parameter
Static
Dynamic
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the
processor IHS.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must
also provide the minimum specified load on the processor package.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only and do not include the limits of the processor socket.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static
load requirement.
3.4

Package Handling Guidelines

Table 3-2
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 3-2.

Package Handling Guidelines

NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top
surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the
IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal
to the IHS top surface.
4. These guidelines are based on limited testing for design characterization.
Datasheet
provides dynamic and static load specifications for the processor package.
Minimum
80 N [17 lbf]
—
includes a list of guidelines on package handling in terms of recommended
Parameter Maximum Recommended
Shear
Tensile
Torque
Figure 3-2
Maximum
311 N [70 lbf]
756 N [170 lbf]
311 N [70 lbf]
111 N [25 lbf]
3.95 N-m [35 lbf-in]
and Figure 3-3 for keep-
Notes
1, 2, 3
1, 3, 4
Notes
1, 4
2, 4
3, 4
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