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Getting Started
2.2
Major Features
Table 5
lists the major features of the development kit.
Table 5.
Development Kit Feature Set Summary (Sheet 1 of 2)
Feature
Intel
Processor
cache
Intel
CPU Voltage Regulator
MVP 6)
Little Bay: 4.92 x 3.74 inch (125 x 95 mm)
Board Size
Shell Bay: 9.6 x 8 inch (243.84 x 203.2 mm)
Single-channel DDR2, dual ranks, memory
Memory
down on PCB, 800 MT/s data rate
Main Clock
IDT* ICS9LPRS436 CK505 compliant clock
16Mbit SPI serial flash (SST25VF016B) on the
SPI
COM Express module for storing boot code
ITP Support
Extended Debug Port (XDP)
Platform Controller
Intel
Hub
COM Express*
COM Express* (Type-2) Connector
1 connector (from COM Express* connector)
LVDS
(30pin)
1 slot of PCIe* x16 height vertical edge card
SDVO
connector (PCIe* Graphics) (from COM
Express* connector)
2 slots of PCIe* x4 height vertical edge card
PCIe* slot
connector via Pericom PI2PCIE212-D signal
switch
PCIe* Signal Switch
1
1 slot (alternate with a PCIe* slot) via Pericom
PCIe* Mini Card
PI2PCIE212-D signal switch
PCIe*-PCI Bridge
1
PCI slot
1 slot via PCIe*-PCI Bridge
SATA
2 ports from PCH
4 ports of Type A receptacle from PCH, 2
USB 2.0 Host
headers from PCH
USB 2.0 Client
1 port from PCH
1 port from PCH,
GbE
GMAC interface: RGMII
SD/SDIO/MMC
2x SD Card slots with MMC (8bit) support
3xRS232C by DB-9 (1 of them from SIO),
1xRS485/RS232C selectable by DB-9 and
UART
header with flow control, via RS transceiver,
1 port by header from PCH directly
SIO
1
January 2012
Document Number: 324213-002
Board Implementation
®
Atom™ Processor E660 with 512KB L2
®
Mobile Voltage Positioning 6 (Intel
®
PCH EG20T x1
®
Intel
Atom™ Processor E660 with Intel
Comments
Supports 0.6 GHz (Ultra Low Power SKU), 1.0 GHz
(Entry SKU), 1.3 GHz (Mainstream SKU) or 1.6 GHz
®
(Premium SKU) Intel
22 X 22 mm FCBGA package with 0.8 mm diagonal
ball pitch and 676 pins.
®
Single phase voltage regulators (U5C1, U5B2) on the
COM Express module.
Doubled-sided placement.
Supports up to 2-GB of system memory, eight SDRAM
devices max (4 on top and 4 on bottom), JEDEC
standard DDR2, soldered down memory only
U4D1 on the COM Express module, TSSOP, 48-pin
package
2x4 header (J1A2) on the COM Express module for
DediProg SF100* programmer
J1A1 XDP connector
Connects to the COM Express* Module by PCIe* x1
Interface to the COM Express* module
Single 18/24-bit LVDS interface; Back Light Inverter
(BLI) and LED backlight support.
Supports ADD2-N cards
Each slot is assigned PCIe* x1 signals (Not using x4
signals)
Pericom PI2PCIE212-D
Pericom PI7C9X111SL
SMI pin of PCH is connected to COM Express* pin C63
for legacy USB support.
Connector: Mini-B receptacle
PHY chip:
1 Realtek RTL8211CL
RS-232C Transceiver: MAXIM MAX3245ECAI+
RS-485 Transceiver: MAXIM MAX3076EESD+
SMSC LPC47M172
®
Platform Controller Hub EG20T Development Kit
Atom™ Processor E660.
User Manual
15
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