Ground; Table 2-3 Grounds - Motorola DSP56012 User Manual

Signal Descriptions

Ground

2.3

GROUND

Ground Name
GND PLL Ground—GND
P
provided with an extremely low-impedance path to ground. V
bypassed to GND
package.
GND Internal Logic Ground—GND
Q
logic. This connection must be tied externally to all other chip ground
connections. The user must provide adequate external decoupling capacitors.
GND
A Ground—GND
A
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
GND D Ground—GND
D
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
GND Host Ground—GND
H
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
GND
Serial Host Ground—GND
S
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
2-6

Table 2-3 Grounds

Description
is ground dedicated for PLL use. The connection should be
P
by a 0.1 F capacitor located as close as possible to the chip
P
is an isolated ground for the internal processing
Q
is an isolated ground for sections of the internal logic. This
A
is an isolated ground for sections of the internal logic. This
D
is an isolated ground for the HI I/O drivers. This
H
is an isolated ground for the SHI I/O drivers. This
S
DSP56012 User's Manual
should be
CCP
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