Recommended Bios/Processor/Memory Test Procedures; Material And Recycling Requirements - Intel Xeon E5-2400 Thermal/Mechanical Design Manual

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6.2.3

Recommended BIOS/Processor/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental

stresses, with the thermal mechanical enabling components assembled. The test shall

be conducted on a fully operational baseboard that has not been exposed to any

battery of tests prior to the test being considered.

The testing setup should include the following components, properly assembled and/or

connected:

• Appropriate system baseboard.

• Processor and memory.

• All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the

checking of BIOS, basic processor functions and memory, without any errors.

6.3

Material shall be resistant to fungal growth. Examples of non-resistant materials

include cellulose materials, animal and vegetable based adhesives, grease, oils, and

many hydrocarbons. Synthetic materials such as PVC formulations, certain

polyurethane compositions (for example, polyester and some polyethers), plastics

which contain organic fillers of laminating materials, paints, and varnishes also are

susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-

STD-810E, Method 508.4 must be performed to determine material performance.

Any plastic component exceeding 25 gm should be recyclable per the European Blue

Angel recycling standards.

The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS

compliant.

Lead-free and Pb-free: Lead has not been intentionally added, but lead may still

exist as an impurity below 1000 ppm.

RoHS compliant: Lead and other materials banned in RoHS Directive are either

(1) below all applicable substance thresholds as proposed by the EU or (2) an

approved/pending exemption applies.

Note:

RoHS implementation details are not fully defined and may change.

Quality and Reliability Requirements

Intel® Xeon® Processor E5-2400 Product Family

Thermal/Mechanical Design Guide

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