General Site Guidelines; Preparation Overview - Juniper QFX5200 Hardware Manual

Table 17: QFX5200 Switch Environmental Tolerances (continued)
Description
Relative humidity
Temperature
Seismic
Related
Documentation

General Site Guidelines

Copyright © 2017, Juniper Networks, Inc.
Tolerance
Normal operation ensured in relative humidity range of 5% through 90%,
noncondensing
Short-term operation ensured in relative humidity range of 5% through 93%,
noncondensing
NOTE: As defined in NEBS GR-63-CORE, Issue 3, short-term events can be
up to 96 hours in duration but not more than 15 days per year.
Normal operation ensured in temperature range of 32° F through 104° F (0° C
through 40° C)
Nonoperating storage temperature in shipping container: –40° F through 158° F
(–40° C through 70° C)
Designed to comply with Zone 4 earthquake requirements per NEBS GR-63-CORE,
Issue 3.
NOTE: Install QFX Series devices only in restricted areas, such as dedicated
equipment rooms and equipment closets, in accordance with Articles 110-16,
110-17, and 110-18 of the National Electrical Code, ANSI/NFPA 70.
QFX5200 Clearance Requirements for Airflow and Hardware Maintenance on page 36
Installing and Connecting a QFX5200 on page 57
Efficient device operation requires proper site planning and maintenance and proper
layout of the equipment, rack or cabinet (if used), and wiring closet.
To plan and create an acceptable operating environment for your device and prevent
environmentally caused equipment failures:
Keep the area around the chassis free from dust and conductive material, such as
metal flakes.
Follow prescribed airflow guidelines to ensure that the cooling system functions properly
and that exhaust from other equipment does not blow into the intake vents of the
device.
Follow the prescribed electrostatic discharge (ESD) prevention procedures to prevent
damaging the equipment. Static discharge can cause components to fail completely
or intermittently over time.
Install the device in a secure area, so that only authorized personnel can access the
device.
Chapter 5: Preparation Overview
33