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CP6003-SA
Note ...
Kontron performs comprehensive environmental testing of its products in accor-
dance with applicable standards.
Customers desiring to perform further environmental testing of Kontron prod-
ucts must contact Kontron for assistance prior to performing any such testing.
This is necessary, as it is possible that environmental testing can be destructive
when not performed in accordance with the applicable specifications.
In particular, for example, boards without conformal coating must not be
exposed to a change of temperature exceeding 1K/minute, averaged over a
period of not more than five minutes. Otherwise, condensation may cause irre-
versible damage, especially when the board is powered up again.
Kontron does not accept any responsibility for damage to products resulting
from destructive environmental testing.
1.7
Related Publications
The following publications contain information relating to this product.
Table 1-3:
Related Publications
PRODUCT
CompactPCI Systems and
Boards
PMC Module
XMC Module
Platform Firmware
All Kontron products
Kontron
ID 1044-9757, Rev. 2.0
CompactPCI Specification PICMG 2.0, Rev. 3.0
CompactPCI Packet Switching Backplane Specification PICMG 2.16 Rev. 1.0
CompactPCI System Management Specification PICMG 2.9 Rev. 1.0
CompactPCI Hot Swap Specification PICMG 2.1 Rev. 2.0
IPMI - Intelligent Platform Management Interface Specification v2.0
Kontron CompactPCI Backplane Manual, ID 24229
IEEE 1386-2001, IEEE Standard for a Common Mezzanine Card (CMC) Family
IEEE 1386.1-2001, IEEE Standard Physical and Environmental Layers for PCI
Mezzanine Cards (PMC)
ANSI/VITA 42.0-200x XMC Switched Mezzanine Card Auxiliary Standard
ANSI/VITA 42.3-2006 XMC PCI Express Protocol Layer Standard
Unified Extensible Firmware Interface (uEFI) Specification, Version 2.1
Product Safety and Implementation Guide, ID 1021-9142
CP6003-SA uEFI BIOS User Guide
CP6003-SA IPMI Firmware User Guide
PUBLICATION
Introduction
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