FP-228 Flexible Board
1. Removal procedure
1) Remove soldering at two locations 1 on the FP-031 board and
the FP-228 flexible board, and remove the FP-228 flexible board
(DEW SENSOR) 2 from the mechanism chassis.
FP-031 Flexible adhesive sheet
2 FP-228 Flexible adhesive sheet
2. Attachment procedure
1) Attach the FP-228 flexible board (DEW SENSOR) 2 to the
mechanism chassis and attach the FP-031 board to the FP-228
2) Solder the terminal block at two locations 1 on the FP-031
FP-031 Flexible adhesive
FP-228 Flexible adhesive sheet
Soldering at the
Points to be noted
Use the rubber finger tip cover.
: 941 made by Hakko Mfg.
Soldering iron tip : T1-1BC
Soldering iron tip temperature
Soldering iron tip contacting time: within 2 sec.
Be careful not to create the hollow soldering,
bridge formation, and the holder's claw must not be melt.
: 300 ± 10 ° C