Figure 71. Power Delivery Map - Intel 815 Design Manual

Power Delivery
supplied by the power supply. Due to the requirements of main memory and the PCI 3.3 Vaux
(and possibly other devices in the system), it is necessary to create a dual power rail.
The solutions in this Design Guide are only examples. Many power distribution methods achieve
the similar results. When deviating from these examples, it is critical to consider the effect of a
change.

Figure 71. Power Delivery Map

®
Intel
Platform Power Map
5 VSB 5 V
± 5% ± 5%
5 V dual
switch
In addition to the power planes provided by the ATX power supply, an instantly available Intel
815 chipset platform (using Suspend-to-RAM) requires six power planes to be generated on the
board. The requirements for each power plane are documented in this section. In addition to on-
board voltage regulators, the CRB will have a 5V Dual Switch.
142
815 Chipset
ATX P/S VRM 8.5
with 720 mA
3.3 V 12 V -12 V
± 5% ± 5% ± 10%
VTT regulator
2.5 V regulator
VDDQ regulator
1.8 V regulator
3.3 VSB regulator
AC'97 12V: 12 V ± 0.6 V
500 mA S0, S1
AC'97 -12 V: -12 V ± 1.2 V
100 mA S0, S1
AC'97 5 V: 5 V ± 0.25 V
1.00 A S0,S1
AC'97 5 VSB: 5 VSB ± 0.25 V
500 mA S0, S1
AC'97 3.3 V: 3.3 V ± 0.165 V
1.00 A S0,S1
AC'97 3.3 VSB: 3.3 VSB ± 0.165 V
150 mA S3, S5
USB cable power: 5 V ± 0.25 V
1 A S0, S1; 1 mA S3, S5
Notes:
Shaded regulators / components are ON in S3 and S5.
KB / mouse will not support STR.
Total max. power dissipation for GMCH = 4 W.
Total max. power dissipation for AC'97 = 15 W.
Processor
Core: VCC_VID: 1.5 V
28.5 A S0, S1
Core: VCC_VID: 2.0V
Core: VCC_VID: 1.75 V
15.6A S0, S1
22.6 A S0, S1
VTT: 1.25 V
2.7 A S0, S1
VTT: 1.5 V ± 0.135 V
2.7 A S0, S1
VCC3_3: 3.3 V ± 0.165 V
15 mA S0, S1
CLK
CK815-2.5: 2.5 V ± 0.125 V
100 mA S0, S1
CK815-3.3: 3.3 V ± 0.165 V
280 mA S0, S1
GMCH VDDQ
2.0 A S0, S1
GMCH core: 1.8 V ± 3%
1.40 A S0, S1
GMCH: 3.3 V ± 0.165 V
1.40 A S0, S1
GMCH: 3.3 VSB ± 0.165 V
110 mA S3, S5
ICH hub I/O: 1.8 V ± 0.09 V
55 mA S0, S1
AC'97
ICH core: 3.3 V ± 0.3 V
300 mA S0, S1
ICH resume: 3.3 VSB ± 0.3 V
1.5 mA S0, S1; 300 µA S3, S5
ICH RTC: 3.3 VSB ± 0.3 V
5 µA S0, S1, S3, S5
FWH core: 3.3 V ± 0.3 V
67 mA S0, S1
®
Intel 815 Chipset Platform Design Guide
Fan
Serial ports
Serial xceivers-12: 12 V ± 1.2 V
22 mA S0, S1
Serial xceivers-N12: -12 V ± 1.2 V
28 mA S0, S1
Serial xceivers-5: 5 V ± 0.25 V
30 mA S0, S1
Super I/O
LPC super I/O: 3.3V ±0.3V
50 mA S0, S1
PS/2 keyboard/mouse 5 V ± 0.5 V
1 A S0, S1
Intel ® 815 chipset
2 DIMM slots: 3.3 VSB ± 0.3 V
4.8 A S0, S1; 64 mA S3
PCI
82559 LAN down 3.3 VSB ± 0.3 V
195 mA S0,S1; 120 mA S3, S5
(3) PCI 3.3 Vaux: 3.3 VSB ± 0.3 V
1.125 A S0, S1; 60 mA S3, S5
pwr_del_map
R
-12 V