Thermal Considerations; Heatsink Volumetric Keepout Regions - Intel 815 Design Manual

R
5.12

Thermal Considerations

5.12.1

Heatsink Volumetric Keepout Regions

Current heatsink recommendations are only valid for supported Celeron and Pentium III processor
frequencies.
Figure 31 shows the system component keepout volume above the socket connector required for
the reference design thermal solution for high frequency processors. This keepout envelope
provides adequate room for the heatsink, fan and attach hardware under static conditions as well as
room for installation of these components on the socket. The heatsink must be compatible with the
Integrated Heat Spreader (IHS) used by higher frequency Pentium III processors.
Figure 32 shows component keepouts on the motherboard required to prevent interference with the
reference design thermal solution. Note portions of the heatsink and attach hardware hang over the
motherboard.
Adhering to these keepout areas will ensure compatibility with Intel boxed processor products and
Intel enabled third party vendor thermal solutions for high frequency processors. While the
keepout requirements should provide adequate space for the reference design thermal solution,
systems integrators should check with their vendors to ensure their specific thermal solutions fit
within their specific system designs. Ensure that the thermal solutions under analysis comprehend
the specific thermal design requirements for higher frequency Pentium III processors.
While thermal solutions for lower frequency processors may not require the full keepout area,
larger thermal solutions will be required for higher frequency processors, and failure to adhere to
the guidelines will result in mechanical interference.
®
Intel 815 Chipset Platform Design Guide
System Bus Design Guidelines
65