Mechanical Specifications; Boxed Processor Cooling Solution Dimensions; Mechanical Representation Of The Boxed Processor - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Thermal mechanical specifications and design guidelines (tmsdg) for 2nd generation intel core processor family desktop and lga1155 socket
Table of Contents

Advertisement

Figure 11-1. Mechanical Representation of the Boxed Processor
Note:
The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
11.2

Mechanical Specifications

11.2.1

Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed processor. The
boxed processor will be shipped with an unattached fan heatsink.

mechanical representation of the boxed processor.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in
View). The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in
(marked with alphabetic designations) to clarify relative dimensioning.
94
Figure 11-7
and
Figure
Figure 11-2
(Side View), and
11-8. Note that some figures have centerlines shown
Thermal/Mechanical Specifications and Design Guidelines
Boxed Processor Specifications
Figure 11-1
shows a
Figure 11-3
(Top

Hide quick links:

Advertisement

Table of Contents
loading

Table of Contents