Heat Pipe Thermal Considerations; Ttv Die Size And Orientation - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications
Thermal mechanical specifications and design guidelines (tmsdg) for 2nd generation intel core processor family desktop and lga1155 socket
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ATX Reference Thermal Solution
9.7
Heat Pipe Thermal Considerations
The following drawing shows the orientation and position of the 1155-land LGA Package
TTV die, this is the same package layout as used in the 1156-land LGA Package TTV.
The TTV die is sized and positioned similar to the production die.
Figure 9-9.
TTV Die Size and Orientation
Package Centerline
Thermal/Mechanical Specifications and Design Guidelines
Die Centerline
37.5
10.94
Drawing Not to Scale
All Dimensions in mm
§§
87
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