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Intel CORE i3-2000 Series manual available for free PDF download: Specifications
INTEL CORE i3-2000 Series Specifications (134 pages)
Thermal Mechanical Specifications and Design Guidelines (TMSDG) for 2nd Generation Intel Core Processor Family Desktop and LGA1155 Socket
Brand:
INTEL
| Category:
Computer Hardware
| Size: 2.8 MB
Table of Contents
Table of Contents
3
Revision History
8
1 Introduction
9
Intel ® Core™ I7-2000 and I5-2000 Desktop Processor Series (Quad Core 95W)
9
References
10
Definition of Terms
10
Reference Documents
10
Terms and Descriptions
10
2 Package Mechanical & Storage Specifications
13
Package Mechanical Specifications
13
Processor Package Assembly Sketch
13
Package Mechanical Drawing
14
Processor Component Keep-Out Zones
14
Package View
14
Package Loading Specifications
15
Package Handling Guidelines
15
Package Insertion Specifications
15
Processor Mass Specification
15
Processor Loading Specifications
15
Processor Materials
16
Processor Markings
16
Processor Top-Side Markings
16
Processor Land Coordinates
17
Processor Package Lands Coordinates
17
Processor Storage Specifications
18
Storage Conditions
18
3 LGA1155 Socket
19
LGA1155 Socket with Pick and Place Cover
19
Board Layout
20
LGA1155 Socket Contact Numbering (Top View of Socket)
20
LGA1155 Socket Land Pattern (Top View of Board)
21
Suggested Silkscreen Marking for Socket Identification
22
Attachment to Motherboard
22
Suggested Board Marking
22
Socket Components
23
Socket Body Housing
23
Solder Balls
23
Contacts
23
Pick and Place Cover
23
Package Installation / Removal
24
Pick and Place Cover
24
Socket Standoffs and Package Seating Plane
25
Durability
25
Markings
25
Package Installation / Removal Features
25
Component Insertion Forces
26
Socket Size
26
4 Independent Loading Mechanism (ILM)
27
Design Concept
27
ILM Assembly Design Overview
27
ILM Back Plate Design Overview
28
ILM Assembly with Installed Processor
28
Shoulder Screw and Fasteners Design Overview
29
Back Plate
29
Assembly of ILM to a Motherboard
30
Shoulder Screw
30
ILM Assembly
31
ILM Interchangeability
32
Markings
32
Pin1 and ILM Lever
32
ILM Cover
33
ILM Cover
34
ILM Cover and Pnp Cover Interference
35
5 LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
37
Component Mass
37
Package/Socket Stackup Height
37
Socket Component Mass
37
1155-Land Package and LGA1155 Socket Stackup Height
37
Loading Specifications
38
Socket & ILM Mechanical Specifications
38
Electrical Requirements
39
Electrical Requirements for LGA1155 Socket
39
Environmental Requirements
40
Flow Chart of Knowledge-Based Reliability Evaluation Methodology
40
6 Thermal Specifications
41
Processor Thermal Specifications
42
Intel
43
(Quad Core 95W) Thermal Profile
43
Thermal Test Vehicle Thermal Profile for Intel Core™ I7-2000 and I5-2000 Desktop Processor Series (Quad Core 95W)
43
Thermal Test Vehicle Thermal Profile for Intel
43
Thermal Test Vehicle Thermal Profile for Intel Core™ I7-2000 and I5-2000 Desktop Processor Series (Quad Core 65W) and Intel Core™ I3-2000 Desktop Processor Series (Dual Core 65W)
44
Thermal Test Vehicle Thermal Profile for Intel
44
Desktop Processor Series (Dual Core 65W)
44
Core™ I5-2000 Desktop Processor Series (Quad Core 45W)
46
Thermal Profile
46
Thermal Test Vehicle Thermal Profile for Intel ® Core™ I5-2000 Desktop Processor Series (Quad Core 45W)
46
Core™ I5-2000 and I3-2000 Desktop Processor Series (Dual Core 35W) Thermal Profile
47
Processor Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL
48
I5-2000 Desktop Processor Series (Quad Core 65W) and Intel
48
Desktop Processor Series (Quad Core 45W)
50
Thermal Metrology
52
Processor Thermal Features
53
Adaptive Thermal Monitor
53
Processor Temperature
53
Frequency/VID Control
54
Clock Modulation
55
Immediate Transition to Combined TM1 and TM2
55
Frequency and Voltage Ordering
55
Critical Temperature Flag
56
PROCHOT# Signal
56
THERMTRIP# Signal
56
Intel Turbo Boost Technology
57
Intel ® Turbo Boost Technology Frequency
57
Intel® Turbo Boost Technology Graphics Frequency
57
Thermal Considerations
58
Intel ® Turbo Boost Technology Power Control and Reporting
58
Package Power Control
59
Power Plane Control
60
Turbo Time Parameter
60
7 PECI Interface
61
Platform Environment Control Interface (PECI)
61
Introduction
61
Fan Speed Control with Digital Thermal Sensor
61
8 Sensor Based Thermal Specification Design Guidance
63
Sensor Based Specification Overview (DTS 1.0)
63
Comparison of Case Temperature Versus Sensor Based Specification
64
Sensor Based Thermal Specification
65
TTV Thermal Profile
65
Specification When DTS Value Is Greater than TCONTROL
66
Thermal Solution Design Process
66
Thermal Solution Performance
66
Boundary Condition Definition
67
I5-2000 Desktop Processor Series (Quad Core 95W)
67
Test for Compliance to the TTV Thermal Profile
68
Thermal Design and Modelling
68
Thermal Solution Characterization for Fan Speed Control
68
Thermal Solution Validation
68
Fan Speed Control (FSC) Design Process
69
Thermal Solution Performance Versus Fan Speed
69
Fan Speed Control Algorithm Without TAMBIENT Data
70
Fan Speed Control Algorithm with TAMBIENT Data
71
DTS 1.1 a New Fan Speed Control Algorithm Without TAMBIENT Data
73
DTS 1.1 Definition Points
74
Fan Speed Control Implementation Details
75
Fan Speed Control Example for 95W TDP Processor1
75
System Validation
76
Fan Response Comparison with Various Fan Speed Control Options
76
Thermal Solution Characterization
77
Thermal Solution Performance above TCONTROL
78
9 ATX Reference Thermal Solution
79
Heatsink Thermal Solution
79
Reference Thermal Solutions
79
ATX Heatsink Reference Design Assembly
80
Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design
81
ATX KOZ 3-D Model Primary (Top) Side
81
Reference Design Components
82
Clip
82
Extrusion
82
RCBFH Extrusion
82
Core
83
Clip for Existing Solutions to Straddle LGA1155 Socket
83
Mechanical Interface to the Reference Attach Mechanism
84
Core
84
Clip Core and Extrusion Assembly
85
Critical Parameters for Interface to the Reference Clip
85
Heatsink Mass & Center of Gravity
86
Thermal Interface Material
86
Critical Core Dimensions
86
Heat Pipe Thermal Considerations
87
TTV die Size and Orientation
87
10 Thermal Solution Quality and Reliability Requirements
89
Reference Heatsink Thermal Verification
89
Mechanical Environmental Testing
89
Use Conditions (Board Level)
89
Recommended Test Sequence
90
Post-Test Pass Criteria
90
Recommended Bios/Processor/Memory Test Procedures
90
Material and Recycling Requirements
91
11 Boxed Processor Specifications
93
Introduction
93
Mechanical Specifications
94
Boxed Processor Cooling Solution Dimensions
94
Mechanical Representation of the Boxed Processor
94
Space Requirements for the Boxed Processor (Side View)
95
Space Requirements for the Boxed Processor (Top View)
95
Boxed Processor Fan Heatsink Weight
96
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
96
Electrical Requirements
96
Fan Heatsink Power Supply
96
Space Requirements for the Boxed Processor (Overall View)
96
Boxed Processor Fan Heatsink Power Cable Connector Description
97
Fan Heatsink Power and Signal Specifications
97
Thermal Specifications
98
Boxed Processor Cooling Requirements
98
Baseboard Power Header Placement Relative to Processor Socket
98
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View)
99
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View)
99
Variable Speed Fan
100
Boxed Processor Fan Heatsink Set Points
100
Fan Heatsink Power and Signal Specifications
101
A Component Suppliers
103
B Mechanical Drawings
105
C Socket Mechanical Drawings
121
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