Core 2 duo mobile processor, intel core 2 solo mobile processor and intel core 2 extreme mobile processor on 45-nm process, platforms based on mobile intel 4 series express chipset family (113 pages)
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Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling1-800-548- 4725, or by visiting Intel's website at http://www.intel.com.
Contents Introduction... 11 Overview ... 11 Processor Abstraction Layer ... 11 Mixing Processors of Different Frequencies and Cache Sizes ... 12 Terminology... 12 State of Data ... 12 Reference Documents... 13 Electrical Specifications... 15 ® Itanium 2.1.1 System Bus Power Pins ... 15 2.1.2 System Bus No Connect ...
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® Itanium Logical Schematic of SMBus Circuitry ... 80 Tables ® Itanium ® Itanium ® Itanium AGTL+ Signals DC Specifications... 18 Power Good Signal DC Specifications ... 19 System Bus Clock Differential HSTL DC Specifications ... 19 TAP Connection DC Specifications... 19 SMBus DC Specifications ...
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Thermal Sensing Device SMBus Addressing on the Itanium EEPROM SMBus Addressing on the Itanium Processor Information ROM Format ... 82 Current Address Read SMBus Packet ... 86 Random Address Read SMBus Packet ... 86 Byte Write SMBus Packet ... 86 Write Byte SMBus Packet ...
Initial release of this document. -002 Updated content to include information pertaining to Itanium 2 processor (1.5 GHz, 6 MB), Itanium 2 processor (1.4 GHz, 4 MB) and Itanium 2 processor (1.3 GHz, 3 MB). -003 Updated content to include information pertaining to Itanium processor (1.5 GHz, 4 MB) and Itanium 2 processor (1.6 GHz, 6 MB and...
Microsoft Windows*, HP-UX* and Linux*. The Itanium 2 processor is designed to support very large scale systems, including those employing thousands of processors, to provide the processing power and performance head room for the most demanding enterprise and technical computing applications.
This strategy increases the synergy between hardware and software, and leads to greater overall performance. The Itanium 2 processor provides a 6-wide and 8-stage deep pipeline, running at up to 1.66 GHz. This provides a combination of abundant resources to exploit ILP as well as increased frequency for minimizing the latency of each instruction.
, or a capitalized abbreviated subscript, for example, T CC,core State of Data The data contained in this document is subject to change. It is the best information that Intel is able to provide at the publication date of this document. Datasheet...
® Intel Itanium Processor Family System Abstraction Layer Specification ITP700 Debug Port Design Guide System Management Bus Specification Note: Contact your Intel representative or check http://developer.intel.com for the latest revision of the reference documents. Datasheet Title Introduction Document Number 251141...
AGTL+ inputs use differential receivers which require a reference signal (V the receivers to determine if a signal is a logical 0 or a logical 1. The Itanium 2 processor generates on-die, thereby eliminating the need for an off-chip reference voltage source.
The TAP Connection Output signals are AGTL+ output signals. The Itanium 2 processor system bus requires termination on both ends of the bus. The Itanium 2 processor system bus supports both on-die and off-die termination controlled by two pins, TERMA and TERMB.
VCCMON, VSSMON Package Specifications Table 2-2 through Table 2-9 processor. The voltage and current specifications are defined at the Itanium 2 processor pins. Operational specifications listed in specifications for case temperature, clock frequency, and input voltages. ® Table 2-2. Itanium...
5. Maximum thermal design envelope is provided for the design of thermal/chassis solutions. 6. Maximum thermal design power is an estimate of the power dissipation for the Itanium 2 processor offering while executing a worst-case application mix under nominal V ®...
Table 2-4. AGTL+ Signals DC Specifications (Sheet 2 of 2) Symbol Leakage Current AGTL+ Pad Capacitance AGTL+ NOTES: 1. The typical transition point between V ±100 mV respectively, for a system bus agent using on-board termination. V mV respectively, for a system bus agent using on-die termination. 2.
THRMALERT#. applies only to THRMALERT# which is an open drain signal. Parameter Minimum Table 2-11 list the AC specifications for the Itanium 2 processor’s clock and Figure 2-1). The Itanium 2 processor uses a differential HSTL System Minimum...
Table 2-10. System Bus Clock Differential HSTL AC Specifications (Sheet 2 of 2) Symbol Parameter BCLKp Low Time BCLKp Period period System Clock Skew skew BCLKp Frequency BCLK BCLKp Input Jitter jitter BCLKp High Time high BCLKp Low Time BCLKp Rise Time rise BCLKp Fall Time fall...
Maximum Ratings Table 2-12 contains the Itanium 2 processor stress ratings. Functional operation at the absolute maximum and minimum is neither implied nor guaranteed. The processor should not receive a clock while subjected to these conditions. Functional operating conditions are given in the DC tables.
Magnitude describes the maximum potential difference between a signal and its voltage reference level. For the Itanium 2 processor, both are referenced to GND as shown in important to note that overshoot and undershoot conditions are separate and their impact must be determined independently.
Electrical Specifications Figure 2-3. System Bus Signal Waveform Exhibiting Overshoot/Undershoot CTERM 2.5.2 Overshoot/Undershoot Pulse Duration Pulse duration describes the total time an overshoot/undershoot event exceeds the overshoot/undershoot reference voltage (V oscillations above the reference voltage. Multiple overshoot/undershoot pulses within a single overshoot/undershoot event may need to be measured to determine the total pulse duration.
4. Ringback below VCTERM cannot be subtracted from overshoots/undershoots. 5. Lesser undershoot does not allocate overshoot with longer duration or greater magnitude. 6. OEM’s are strongly encouraged to follow Intel layout guidelines. 7. All values specified by design characterization. 2.5.5...
Electrical Specifications 3. If multiple overshoots and/or multiple undershoots occur, measure the worst-case pulse duration for each magnitude and compare the results against the AF = 1 specifications. If all of these worst-case overshoot or undershoot events meet the specifications (measured time < specifications) in the table (where AF = 1), then the system passes.
1. Activity Factor = 1 means signal toggles every 6 ns. Power Pod Connector Signals Power delivery for the Itanium 2 processor is from a DC-DC converter called the “power pod”. The power pod consists of a DC-DC converter and a semi-flexible connector which delivers the voltage to the processor.
3.3 V power supply. The VID pads on the power connector tab will be pulled low with 10 Ω resistors that are internal to the processor. The 10 Ω resistive pulldowns are controlled by Intel and will not be externally adjustable. Table 2-23. Processor Core Voltage Identification Code Processor Pins: 0 = Connected to GND;...
All Itanium 2 processor system bus timing parameters are specified with respect to the falling edge of BCLKn and rising edge of BCLKp. The Itanium 2 processor core to bus ratio must be configured during system reset by using the A[21:17]# pins (see these pins during the system reset sequence determines the multiplier that the PLL will use for the internal core clock.
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• The Itanium 2 processor 900 MHz with 1.5 MB L3 cache supports a bus ratio of 2/9. • The Itanium 2 processor 1.0 GHz with 3 MB L3 cache supports a bus ratio of 2/10.
Electrical Specifications Figure 2-6. System Bus Reset and Configuration Timings for Cold Reset BCLK PWRGOOD RESET# Bus Ratio (A[21:17]#) Additional Configuration Signals = 1.15 ns minimum; (set up time to BCLK for deassertion edge of RESET#) = 1 ms minimum for cold reset = Bus ratio signals must be asserted no later than RESET# = 2 BCLKs minimum, 3 BCLKs maximum = 4 BCLKs minimum...
Figure 2-7. System Bus Reset and Configuration Timings for Warm Reset BCLK PWRGOOD RESET# Bus Ratio (A[21:17]#) Additional Configuration Signals = 1.15 ns minimum; (set up time to BCLK for deassertion edge of RESET#) = 1 ms minimum for warm reset = Bus ratio signals must be asserted no later than RESET# = 2 BCLKs minimum, 3 BCLKs maximum = 4 BCLKs minimum...
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Electrical Specifications Table 2-26. Connection for Unused Pins (Sheet 2 of 2) Pins/Pin Groups System Management Signals 3.3V SMA[2:0] SMSC SMSD SMWP THRMALERT# LVTTL Power Pod Signals OUTEN PPODGD# CPUPRES# Reserved Pins NOTES: 1. L = GND, H = V CTERM 2.
Pinout Specifications This chapter describes the Itanium 2 processor signals and pinout. Note: The pins labeled “N/C” must remain unconnected. The Itanium 2 processor uses a JEDEC standard pin naming convention. In this chapter, pin names are the actual names given to each physical pin of the processor.
Pinout Specifications Table 3-1 provides the Itanium 2 processor pin list in alphabetical order. Table 3-2 provides the Itanium 2 processor pin list by pin location. Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 1 of 15) Pin Name 3.3V...
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Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 2 of 15) Pin Name A040# A041# A042# A043# A044# A045# A046# A047# A048# A049# A20M# ADS# AP0# AP1# BCLKn BCLKp BERR# BINIT# BNR# BPM0# BPM1# BPM2# BPM3# BPM4# BPM5# BPRI# BR0# BR1# BR2#...
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Pinout Specifications Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 3 of 15) Pin Name D010# D011# D012# D013# D014# D015# D016# D017# D018# D019# D020# D021# D022# D023# D024# D025# D026# D027# D028# D029# D030# D031# D032# D033# D034# D035# D036#...
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Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 4 of 15) Pin Name D051# D052# D053# D054# D055# D056# D057# D058# D059# D060# D061# D062# D063# D064# D065# D066# D067# D068# D069# D070# D071# D072# D073# D074# D075# D076# D077# D078# D079#...
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Pinout Specifications Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 5 of 15) Pin Name D092# D093# D094# D095# D096# D097# D098# D099# D100# D101# D102# D103# D104# D105# D106# D107# D108# D109# D110# D111# D112# D113# D114# D115# D116# D117# D118#...
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Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 6 of 15) Pin Name DEP01# DEP02# DEP03# DEP04# DEP05# DEP06# DEP07# DEP08# DEP09# DEP10# DEP11# DEP12# DEP13# DEP14# DEP15# DRDY# DRDY0# DRDY1# FERR# Datasheet System Bus Input/Output Signal Name Location DEP1# DEP2# DEP3#...
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Pinout Specifications Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 7 of 15) Pin Name System Bus Input/Output Signal Name Location AB19 AB21 AB23 AB25 AC02 AC24 AD01 AD03 AD05 AD07 AD09 AD11 AD13 AD15 AD17 AD19 AD21 AD23 AD25 AE02 AE24...
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Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 8 of 15) Pin Name Datasheet System Bus Input/Output Signal Name Location AG22 AG24 AH01 Pinout Specifications Notes...
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Pinout Specifications Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 9 of 15) Pin Name System Bus Input/Output Signal Name Location Notes Datasheet...
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Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 10 of 15) Pin Name Datasheet System Bus Input/Output Signal Name Location Pinout Specifications Notes...
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Pinout Specifications Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 11 of 15) Pin Name GSEQ# HIT# HITM# ID0# System Bus Input/Output Signal Name Location GSEQ# AD14 HIT# AB10 HITM# AB12 IDA0#/IP0# AD02 Notes IN/OUT IN/OUT Datasheet...
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Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 12 of 15) Pin Name ID1# ID2# ID3# ID4# ID5# ID6# ID7# ID8# ID9# IDS# IGNNE# INIT# LINT0 LINT1 LOCK# Datasheet System Bus Input/Output Signal Name Location IDA1#/IP1# AB02 IDA2#/DHIT# AC03 IDA3#/IDB3# AA03 IDA4#/IDB4#...
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Pinout Specifications Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 13 of 15) Pin Name OUTEN PMI# PPODGD# PWRGOOD REQ0# REQ1# REQ2# REQ3# REQ4# REQ5# RESET# RS0# RS1# RS2# RSP# SBSY# SBSY0# SBSY1# SMA0 SMA1 SMA2 SMSC SMSD SMWP STBN0# STBN1# STBN2#...
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Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 14 of 15) Pin Name STBP2# STBP3# STBP4# STBP5# STBP6# STBP7# TERMA TERMB THRMTRIP# THRMALERT# TND# TRDY# TRST# TUNER[1] TUNER[2] VCCMON VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM...
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Pinout Specifications Table 3-1. Pin/Signal Information Sorted by Pin Name (Sheet 15 of 15) Pin Name VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM VCTERM...
This chapter provides the mechanical specifications of the Itanium 2 processor. Mechanical Dimensions The Itanium 2 processor package is comprised of an interposer, a processor package substrate, and an integrated heat spreader (IHS), as illustrated in socket and the power pod and contains 611 pins which are positioned in a 25 x 28 grid. The IHS, which is mounted on the top surface of the processor package substrate, efficiently transfers the heat generated by the die to its surface.
Country of origin • 2D Matrix Mark (on Itanium 2 processor [1.30 GHz, 1.40 GHz, 1.50 GHz, 1.60 GHz], Itanium 2 (9 MB) class of processors and Montecito class of processors only. Not included on the Itanium 2 [900 MHz, 1.0 GHz] processor).
This chapter provides a description of the thermal features relating to the Itanium 2 processor. Thermal Features The Itanium 2 processor has an internal thermal circuit which senses when a certain temperature is reached on the processor core. This circuit is used for controlling various thermal states. In addition, an on-chip thermal diode is available for use by the thermal sensing device on the Itanium 2 processor.
5.1.2 Enhanced Thermal Management ETM is a new feature that has been added to the Itanium 2 processor. ETM uses a thermal sensing device on the die to monitor a thermal entry point, indicating dangerous operation exceeding the thermal specification. Once the thermal sensing device observes the temperature rise above the thermal entry point, the processor will enter a low power mode of execution and notify the system by sending a Correctable Machine Check Interrupt (CMCI).
Thermal Specifications ® Figure 5-2. Itanium 2 Processor Package Thermocouple Location 24.13 45.00 Thermocouple Location All dimensions are measured in mm. Not to scale. 001103a Datasheet...
The thermal sensing device is connected to the anode and cathode of the Itanium 2 processor on-die thermal diode. SMBus implementation on the Itanium 2 processor uses the clock and data signals as defined by SMBus specifications.
NOTE: 1. Actual implementation may vary. 2. For use in general understanding of the architecture. 3.3V Processor Information Scratch EEPROM SMWP SMSD SMSC Stuffing Options Intel ® Itanium ® 2 Processor Core THERMDA THERMDC STBY Thermal Sensing Device ALERT THRMALERT# 3.3V...
3.3V (‘1’) for the processor information ROM. The “XX” bits are defined by the processor socket via the SMA0 and SMA1 pins on the Itanium 2 processor connector. These address pins have a weak pull-down (10 kΩ) to ensure that the memory components are in a known state in systems which do not support the SMBus, or only support a partial implementation.
System Management Feature Specifications Table 6-3. EEPROM SMBus Addressing on the Itanium Upper Address Address (Hex) Bits 7–4 A0h/A1h 1010 A2h/A3h 1010 A4h/A5h 1010 A6h/A7h 1010 A8h/A9h 1010 AAh/ABh 1010 ACh/ADh 1010 AEh/AFh 1010 NOTES: 1. Though this addressing scheme is targeted for up to four-way MP systems, more processors can be supported by using a multiplexed (or separate) SMBus implementation.
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Table 6-4. Processor Information ROM Format (Sheet 2 of 4) Offset/ # of Section Bits Feature Data Address Other Data Address Reserved Checksum Processor S-spec Number Sample/Production Reserved Checksum Core Architecture Revision Processor Core Family Processor Core Model Processor Core Stepping Reserved Maximum Core Frequency Maximum System Bus...
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• 3Ah = 2 or 3 Add up by byte and take 2’s complement Itanium 2 (900 MHz, 1.0 GHz) = 80542KC. Itanium 2 processor (1.30 GHz -1.66 GHz) = 80543KC: • 3Eh = “8” • 3Fh = “0” • 40h = “5”...
Also available on the SMBus interface on the processor is an EEPROM which may be used for other data at the system vendor’s discretion (Intel will not be using the scratch EEPROM). The data in this EEPROM, once programmed, can be write-protected by asserting the active-high SMWP signal.
These values can be individually programmed on the thermal sensor. If the measured temperature equals or exceeds the alarm threshold value, the appropriate bit is set in the thermal sensing device status register, which is also brought out to the Itanium 2 processor system bus via the Table 6-7, ‘S’...
THRMALERT# signal (see register values need to be programmed into the thermal sensing device via the SMBus. It is recommended that the upper thermal reference threshold byte (provided in the processor information ROM) be used for setting the upper threshold value in the alarm register. When polling the thermal sensing device on the processor to read the processor temperatures, it is recommended that the polling frequency be every 0.5 to 1 second.
System Management Feature Specifications Table 6-13. Command Byte Bit Assignment Register RESERVED RESERVED RESERVED RRHL RRLL RESERVED RESERVED WRHL WRLL OSHT RESERVED All of the commands are for reading or writing registers in the thermal sensor except the one-shot command (OSHT). The one-shot command forces the immediate start of a new voltage-to- temperature conversion cycle.
If the diode thermal value equals or exceeds one of its limits, then its alarm bit in the status register is triggered. This indication is also brought out to the Itanium 2 processor system bus via the THRMALERT# signal.
System Management Feature Specifications 6.7.5 Conversion Rate Register The contents of the conversion rate register determine the nominal rate at which analog-to-digital conversions happen when the thermal sensing device is in auto-convert mode. the mapping between conversion rate register values and the conversion rate. As indicated in Table 6-16, the conversion rate register is set to its default state of 02h (0.25 Hz nominally) when the thermal sensing device is powered-up.
ADS# assertion. These signals must connect the appropriate pins of all agents on the Itanium 2 processor system bus. The A[49:27]# signals are parity-protected by the AP1# parity signal, and the A[26:3]# signals are parity-protected by the AP0# parity signal.
BCLKp and BCLKn on the signals that are using the common clock latched protocol. BCLKp and BCLKn indirectly determine the internal clock frequency of the Itanium 2 processor. Each Itanium 2 processor derives its internal clock by multiplying the BCLKp and BCLKn frequency by a ratio that is defined and allowed by the power-on configuration.
For memory or I/O transactions, the byte-enable signals indicate that valid data is requested or being transferred on the corresponding byte on the 128-bit data bus. BE[0]# indicates that the least significant byte is valid, and BE[7]# indicates that the most significant byte is valid. Since BE[7:0]# specifies the validity of only 8 bytes on the 16 byte wide bus, A[3]# is used to determine which half of the data bus is validated by BE[7:0]#.
Signals Reference A.1.10 BINIT# (I/O) If enabled by configuration, the Bus Initialization (BINIT#) signal is asserted to signal any bus condition that prevents reliable future operation. If BINIT# observation is enabled during power-on configuration, and BINIT# is sampled asserted, all bus state machines are reset. All agents reset their rotating IDs for bus arbitration to the same state as that after reset, and internal count information is lost.
Table A-4. BR0# (I/O), BR1#, BR2#, BR3# Signals for 4P Rotating Interconnect Bus Signal BREQ[0]# BREQ[1]# BREQ[2]# BREQ[3]# Table A-5. BR0# (I/O), BR1#, BR2#, BR3# Signals for 2P Rotating Interconnect Bus Signal BREQ[0]# BREQ[1]# BREQ[2]# BREQ[3]# During power-on configuration, the priority agent must assert the BR[0]# bus signal. All symmetric agents sample their BR[3:0]# pins on asserted-to-deasserted transition of RESET#.
A.1.17 CPUPRES# (O) CPUPRES# can be used to detect the presence of a Itanium 2 processor in a socket. A ground indicates that a Itanium 2 processor is installed, while an open indicates that a Itanium 2 processor is not installed.
A.1.22 DBSY_C2# (O) DBSY# is a copy of the Data Bus Busy signal. This copy of the Data Bus Busy signal (DBSY_C2#) is an output only. A.1.23 DEFER# (I) The DEFER# signal is asserted by an agent to indicate that the transaction cannot be guaranteed in- order completion.
The Data Size (DSZ[1:0]#) signals are transferred on REQb[4:3]# signals in the second clock of the Request Phase by the requesting agent. The DSZ[1:0]# signals define the data transfer capability of the requesting agent. For the Itanium 2 processor, DSZ# = 01, always. A.1.32...
Table A-8. Extended Function Signals Extended Function Signal EXF[4]# EXF[3]# EXF[2]# EXF[1]# EXF[0]# A.1.33 FCL# (I/O) The Flush Cache Line (FCL#) signal is driven to the bus on the second clock of the Request Phase on the A[6]# pin. FCL# is asserted to indicate that the memory transaction is initiated by the global Flush Cache (FC) instruction.
Signals Reference A.1.39 IGNNE# (I) IGNNE# is ignored in the Itanium 2 processor system environment. A.1.40 INIT# (I) The Initialization (INIT#) signal triggers an unmasked interrupt to the processor. INIT# is usually used to break into hanging or idle processor states. Semantics required for platform compatibility are supplied in the PAL firmware interrupt service routine.
NMI, a non-maskable interrupt.Both signals are asynchronous inputs. A.1.45 LOCK# (I/O) LOCK# is never asserted or sampled in the Itanium 2 processor system environment. A.1.46 NMI (I) The NMI signal is the Non-maskable Interrupt signal. Asserting NMI causes an interrupt with an internally supplied vector value of 2.
Signals Reference All receiving agents observe the REQ[5:0]# signals to determine the transaction type and participate in the transaction as necessary, as shown in Table A-10. Transaction Types Defined by REQa#/REQb# Signals Transaction Deferred Reply Reserved Interrupt Acknowledge Special Transactions Reserved Reserved Interrupt...
A correct parity signal is high if an even number of covered signals are low and low if an odd number of covered signals are low. This definition allows parity to be high when all covered signals are high. A.1.53 RS[2:0]# (I) The Response Status (RS[2:0]#) signals are driven by the responding agent (the agent responsible for completion of the transaction).
The Test Clock (TCK) signal provides the clock input for the IEEE 1149.1 compliant TAP. A.1.61 TDI (I) The Test Data In (TDI) signal transfers serial test data into the Itanium 2 processor. TDI provides the serial input needed for IEEE 1149.1 compliant TAP. A.1.62 TDO (O) The Test Data Out (TDO) signal transfers serial test data out from the Itanium 2 processor.
Table A-12. Output Signals (Sheet 1 of 2) Name CPUPRES# DBSY_C1# DBSY_C2# DRDY_C1# DRDY_C2# FERR# Datasheet Table A-15 list attributes of the Itanium 2 processor output, input, and I/O Active Level Clock Signal Group — BCLKp BCLKp BCLKp BCLKp Asynchronous...
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