Processor Thermal Specifications - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Section 6.2. To ensure maximum flexibility for future processors, systems should be
designed to the Thermal Solution Capability guidelines, even if a processor with lower
power dissipation is currently planned.
Table 6-1.

Processor Thermal Specifications

Product
®
Intel Core™ i7-
2000 and i5-2000
desktop processor
series (Quad Core
95W)
®
Intel Core™ i7-
2000 and i5-2000
desktop processor
series (Quad Core
65W)
Intel ® Core™ i3-
2000 desktop
processor series
(Dual Core 65W)
®
Intel Core™ i5-
2000 desktop
processor series
(Quad Core 45W)
Intel ® Core™ i5-
2000 and i3-2000
desktop processor
series (Dual Core
35W)
Notes:
1. The package C-state power is the worst case power in the system configured as follows:
- Memory configured for DDR3 1333 and populated with 2 DIMM per channel.
- DMI and PCIe links are at L1.
2. Specification at Tj of 50 °C and minimum voltage loadline.
3. Specification at Tj of 35 °C and minimum voltage loadline.
4. These values are specified at V
Systems must be designed to ensure the processor is not to be subjected to any static V
combination wherein V
the EDS.
5. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at DTS = -1.
TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.
6. Specified by design characterization.
7. When the Multi-monitor feature is enabled (running 4 displays simultaneously) there could be corner cases
with additional system thermal impact on the SA and VCCP rails ≤1.5W (maximum of 1.5W measured on
16 lane PCIe card). The integrator should perform additional thermal validation with Multi-monitor enabled
to ensure thermal compliance.
42
Max Max
Power Power
Package Package
C1E C3
1,2,6 1,2,6
(W) (W)
28 22
25 18
20 12
20 12
18 10
and V for all other voltage rails for all processor frequencies.
CC_MAX NOM
exceeds V at specified I
CCP CCP_MAX
Thermal/Mechanical Specifications and Design Guidelines
Thermal Specifications
Max TTV
Power Thermal
Min T
Package Design
(°C)
C6 Power
1,3,6 4,5,7
(W) (W)
5.5 95
5.5
65
5
5.5 45
5 35
. Please refer to the loadline specifications in
CCP
Maximum
TTV
CASE
TCASE
(°C)
Figure 6-1
& Table 6-2
Figure 6-2
& Table 6-3
5
Figure 6-3
& Table 6-4
Figure 6-4
& Table 6-5
and I
CC CC