Package Mechanical & Storage Specifications; Package Mechanical Specifications; Processor Package Assembly Sketch - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Package Mechanical & Storage Specifications
2
Package Mechanical & Storage
Specifications
2.1

Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with
the motherboard via the LGA1155 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor thermal
solutions, such as a heatsink.
components and how they are assembled together. Refer to
for complete details on the LGA1155 socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 2-1.

Processor Package Assembly Sketch

Substrate
System Board
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
2. For clarity the ILM not shown.
Thermal/Mechanical Specifications and Design Guidelines
Figure 2-1 shows a sketch of the processor package
Figure 2-1
Core (die)
IHS
Chapter 3
include the following:
TIM
Capacitors
LGA1155 Socket
and Chapter 4
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