Reference Design Components; Extrusion; Clip; Rcbfh Extrusion - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Thermal mechanical specifications and design guidelines (tmsdg) for 2nd generation intel core processor family desktop and lga1155 socket
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9.3

Reference Design Components

9.3.1

Extrusion

The aluminum extrusion design is similar to what is shown in
reuse of the core design, the center cylinder ID and wall thickness are the same as
RCBFH3.
Figure 9-3.

RCBFH Extrusion

9.3.2

Clip

This clip design is intended to adapt previous thermal solutions such as the RCBFH3 to
comply with the mechanical and structural requirements for the LGA1155 socket.
Structural design strategy for the clip is to provide sufficient load for the Thermal
Interface Material (TIM). The clip does not have to provide additional load for socket
solder joint protect.
The clip is formed from 1.6 mm carbon steel, the same material as used in previous clip
designs. The target metal clip nominal stiffness is 493 N/mm [2813 lb/in]. The
combined target for reference clip and fasteners nominal stiffness is 311 N/mm
[1778 lb/in]. The nominal preload provided by the reference design is 175.7 ± 46.7 N
[39.5 lb ±10.5 lbf].
Note:
An updated clip drawing and IGES file is available please order 2009 Reference Thermal
Solution Clip Mechanical Models and Mechanical Drawings to support power on with
existing thermal solutions.
Note:
Intel reserves the right to make changes and modifications to the design as necessary
to the reference design, in particular the clip.
82
ATX Reference Thermal Solution
Figure
Thermal/Mechanical Specifications and Design Guidelines
9-3. To facilitate

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