Board Layout; Lga1155 Socket Contact Numbering (Top View Of Socket) - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Figure 3-2.

LGA1155 Socket Contact Numbering (Top View of Socket)

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3.1

Board Layout

The land pattern for the LGA1155 socket is 36 mils X 36 mils (X by Y) within each of the
two L-shaped sections. Note that there is no round-off (conversion) error between
socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The
two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm
(122.6 mil) in the y direction, see
land to PCB land offset which ensures a single PCB layout for socket designs from the
multiple vendors.
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A C E G J L N R
B D F H K M P T
Figure
U W AA AC AE AG AJ AL AN AR AU AW
V Y AB AD AF AH AK AM AP AT AV AY
3-3. This was to achieve a common package
Thermal/Mechanical Specifications and Design Guidelines
LGA1155 Socket
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