Thermal Metrology - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Thermal mechanical specifications and design guidelines (tmsdg) for 2nd generation intel core processor family desktop and lga1155 socket
Table of Contents

Advertisement

6.1.6

Thermal Metrology

The maximum TTV case temperatures (T
appropriate TTV thermal profile earlier in this chapter. The TTV T
geometric top center of the TTV integrated heat spreader (IHS).
the location where T
for drawing showing the thermocouple attach to the TTV package.
Figure 6-5.
TTV Case Temperature (T
Note:
The following supplier can machine the groove and attach a thermocouple to the IHS.
The supplier is listed below as a convenience to Intel's general customers and the list
may be subject to change without notice. THERM-X OF CALIFORNIA Inc, 3200
Investment Blvd, Hayward, Ca 94545. Ernesto B Valencia +1-510-441-7566 Ext. 242
ernestov@therm-x.com. The vendor part number is XTMS1565.
52
temperature measurements should be made. See
CASE
) Measurement Location
CASE
Measure T
at
CASE
the geometric
center of the
package
) can be derived from the data in the
CASE-MAX
CASE
37.5
Thermal/Mechanical Specifications and Design Guidelines
Thermal Specifications
is measured at the
Figure 6-5
illustrates
Figure B-12

Hide quick links:

Advertisement

Table of Contents
loading

Table of Contents