Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications page 131

Heat Sink Back Plate Drawings
E Heat Sink Back Plate
Drawings
This heat sink back plate design is intended to adapt as a reference for OEMs that use
threaded fasteners on customized thermal solution, to comply with the mechanical and
structural requirements for the LGA1155 socket. The heat sink back plate does not
have to provide additional load for socket solder joint protect. Structural design
strategy for the heat sink is to provide sufficient load for the Thermal Interface Material
(TIM) and to minimize stiffness impact on the motherboard.
Note: Design modifications for specific application and manufacturing are the responsibility of
OEM and the listed vendors for customized system implementation and validation.
These vendors and devices are listed by Intel as a convenience to Intel's general
customer base, but Intel does not make any representations or warranties whatsoever
regarding quality, reliability, functionality, or compatibility of these devices. Customers
are responsible for thermal, mechanical, and environmental validation of these
solutions. This list and/or these devices may be subject to change without notice.
Please refer to the motherboard keep out zone listed in
with the heat sink back plate implementation.
keep in zone for the design implementation.
Table E-1
mechanical drawings
Table E-1. Mechanical Drawing List
"Heat Sink Back Plate Keep In Zone"
"Heat Sink Back Plate"
"Reference Design ILM Back Plate"
Table E-2. Supplier Contact Information
Supplier
CCI (Chaun Choung
Technology Corp.)
The enabled components may not be currently available from supplier. Contact the
supplier directly to verify time of component availability.
Thermal/Mechanical Specifications and Design Guidelines
lists the mechanical drawings included in this appendix.
Drawing Description
Contact
Monica Chih +886-2-29952666 x1131
Appendix B
Figure E-1 is the heat sink back plate
Figure Number
Figure E-1
Figure E-2
Figure E-3
Phone
monica_chih@ccic.com.tw
to ensure compliant
Table E-2 lists the
Email
131