Mechanical Interface To The Reference Attach Mechanism; Core - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Thermal mechanical specifications and design guidelines (tmsdg) for 2nd generation intel core processor family desktop and lga1155 socket
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Figure 9-5.

Core

9.4
Mechanical Interface to the Reference Attach
Mechanism
The attach mechanism component from the Intel Reference Design can be used by
other 3rd party cooling solutions. The attach mechanism consists of:
• A metal attach clip that interfaces with the heatsink core, see
Figure B-11
• Four plastic fasteners, see
component drawings.
Note:
For Intel RCFH6 and RCFH7 Reference Designs, the metal attach clip is not used by the
solutions as shown in
previous thermal solutions (such as the Intel RCBFH3 Reference Design) to comply with
the mechanical and structural requirements for the LGA1155 socket.
If 3rd party cooling solutions adopt a previous thermal solutions (such as the Intel
RCBFH3 Reference Design), the reference attach mechanism (clip, core and extrusion)
portion is shown in
insertion, and is meant to be trapped between the core shoulder and the extrusion as
shown in
The critical to function mechanical interface dimensions are shown in
Figure
9-8. Complying with the mechanical interface parameters is critical to
generating a heatsink preload compliant with the minimum preload requirement for the
selected TIM and to not exceed the socket design limits.
84
for the clip drawings.
Figure B-6, Figure B-7, Figure B-8
Figure
9-1. This metal attach clip design is only intended to adapt
Figure
9-6. The clip is assembled to heatsink during copper core
Figure
9-7.
ATX Reference Thermal Solution
and
Thermal/Mechanical Specifications and Design Guidelines
Figure B-10
and
Figure B-9
for the
Figure 9-7
and

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