Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications page 5

9.3.2 Clip ...................................................................................................... 82
9.3.3 Core ..................................................................................................... 83
9.4 Mechanical Interface to the Reference Attach Mechanism........................................ 84
9.5 Heatsink Mass & Center of Gravity ....................................................................... 86
9.6 Thermal Interface Material.................................................................................. 86
9.7 Heat Pipe Thermal Considerations........................................................................ 87
10 Thermal Solution Quality and Reliability Requirements............................................ 89
10.1 Reference Heatsink Thermal Verification ............................................................... 89
10.2 Mechanical Environmental Testing ....................................................................... 89
10.2.1 Recommended Test Sequence.................................................................. 90
10.2.2 Post-Test Pass Criteria ............................................................................ 90
10.2.3 Recommended BIOS/Processor/Memory Test Procedures ............................. 90
10.3 Material and Recycling Requirements ................................................................... 91
11 Boxed Processor Specifications ............................................................................... 93
11.1 Introduction ..................................................................................................... 93
11.2 Mechanical Specifications ................................................................................... 94
11.2.1 Boxed Processor Cooling Solution Dimensions ............................................ 94
11.2.2 Boxed Processor Fan Heatsink Weight ....................................................... 96
11.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly ..... 96
11.3 Electrical Requirements ...................................................................................... 96
11.3.1 Fan Heatsink Power Supply...................................................................... 96
11.4 Thermal Specifications ....................................................................................... 98
11.4.1 Boxed Processor Cooling Requirements ..................................................... 98
11.4.2 Variable Speed Fan............................................................................... 100
Figures
2-1 Processor Package Assembly Sketch ........................................................................ 13
2-2 Package View ....................................................................................................... 14
2-3 Processor Top-Side Markings .................................................................................. 16
2-4 Processor Package Lands Coordinates ...................................................................... 17
3-1 LGA1155 Socket with Pick and Place Cover ............................................................... 19
3-2 LGA1155 Socket Contact Numbering (Top View of Socket) .......................................... 20
3-3 LGA1155 Socket Land Pattern (Top View of Board) .................................................... 21
3-4 Suggested Board Marking....................................................................................... 22
3-5 Attachment to Motherboard .................................................................................... 22
3-6 Pick and Place Cover.............................................................................................. 24
3-7 Package Installation / Removal Features................................................................... 25
4-1 ILM Assembly with Installed Processor ..................................................................... 28
4-2 Back Plate ............................................................................................................ 29
4-3 Shoulder Screw..................................................................................................... 30
4-4 ILM Assembly ....................................................................................................... 31
4-5 Pin1 and ILM Lever ................................................................................................ 32
4-6 ILM Cover ............................................................................................................ 34
4-7 ILM Cover and PnP Cover Interference ..................................................................... 35
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .............................. 40
6-1 Thermal Test Vehicle Thermal Profile for Intel
Processor Series (Quad Core 95W) .......................................................................... 43
6-2 Thermal Test Vehicle Thermal Profile for Intel
Processor Series (Quad Core 65W) and Intel
Series (Dual Core 65W) ........................................................................................ 44
6-3 Thermal Test Vehicle Thermal Profile for Intel
Series (Quad Core 45W) ........................................................................................ 46
Thermal/Mechanical Specifications and Design Guidelines
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Core™ i7-2000 and i5-2000 Desktop
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Core™ i7-2000 and i5-2000 Desktop
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Core™ i3-2000 Desktop Processor
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Core™ i5-2000 Desktop Processor
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