Heatsink Mass & Center Of Gravity; Thermal Interface Material; Critical Core Dimensions - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Thermal mechanical specifications and design guidelines (tmsdg) for 2nd generation intel core processor family desktop and lga1155 socket
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Figure 9-8.

Critical Core Dimensions

1.00 +/- 0.10 mm
2.45 +/- 0.10 mm
9.5
Heatsink Mass & Center of Gravity
• Total mass including plastic fan housing and fasteners <500 g.
• Assembly center of gravity <= 25.4 mm, measured from the top of the IHS.
9.6

Thermal Interface Material

A thermal interface material (TIM) provides conductivity between the IHS and heat
sink. The designs use Dow Corning TC-1996. The TIM application is 0.14 g, which will
be a nominal 20 mm diameter (~0.79 inches).
86
1.00 mm min
ATX Reference Thermal Solution
Dia 38.68 +/- 0.30mm
Dia 36.14 +/- 0.10 mm
Gap required to avoid
core surface blemish
during clip assembly.
Recommend 0.3 mm min.
Core
Thermal/Mechanical Specifications and Design Guidelines
R 0.40 mm max
R 0.40 mm max

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