Component Insertion Forces; Socket Size - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1155 and the manufacturer's insignia are molded or laser marked on the side wall.
3.7

Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
3.8

Socket Size

Socket information needed for motherboard design is given in
This information should be used in conjunction with the reference motherboard keep-
out drawings provided in
mechanical components.
26
Appendix B to ensure compatibility with the reference thermal
§
Thermal/Mechanical Specifications and Design Guidelines
LGA1155 Socket
Appendix C.