Processor Storage Specifications; Storage Conditions - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

2.2

Processor Storage Specifications

Table 2-4
and minimum temperatures and relative humidity. These conditions should not be
exceeded in storage or transportation.
.
Table 2-4.

Storage Conditions

Parameter
T
ABSOLUTE STORAGE
T
SUSTAINED STORAGE
RH
SUSTAINED STORAGE
TIME
SUSTAINED STORAGE
Notes:
1. Refers to a component device that is not assembled in a board or socket that is not to be electrically
connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by
applicable JEDEC standard Non-adherence may affect processor reliability.
3. T
ABSOLUTE STORAGE
moisture barrier bags or desiccant.
4. Intel branded board products are certified to meet the following temperature and humidity limits that are
given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%,
non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not
specified for non-Intel branded boards.
5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
6. Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
18
includes a list of the specifications for device storage in terms of maximum
The non-operating device storage temperature.
Damage (latent or otherwise) may occur when
subjected to for any length of time.
The ambient storage temperature limit (in
shipping media) for a sustained period of time.
The maximum device storage relative humidity
for a sustained period of time.
A prolonged or extended period of time; typically
associated with customer shelf life.
applies to the unassembled component only and does not apply to the shipping media,
and customer shelf life in applicable intel box and bags.
STORAGE
SUSTAINED
Package Mechanical & Storage Specifications
Description
§
Thermal/Mechanical Specifications and Design Guidelines
Min Max Notes
-55 °C 125 °C 1, 2,
-5 °C 40 °C 4, 5
60% @ 24 °C 5, 6
0 6
6
Months Months
3