Table of Contents
Advertisement
®
TM
Introduction—Intel
Core
Processor
1.2
References
Material and concepts available in the documents listed in
when reading this document.
Table 1.
Referenced Documents
Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core
Processor, and Intel® Pentium® 4 Processor 6x1 Sequence
Thermal and Mechanical Design Guidelines
LGA775 Socket Mechanical Design Guide
Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo
Desktop Processor E6000 Sequence Datasheet
Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet
Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor
Thermal and Mechanical Design Guidelines
Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA
Package Thermal and Mechanical Design Guidelines
Fan Specification for 4-wire PWM Controlled Fans
Performance ATX Desktop System Thermal Design Suggestions
Performance microATX Desktop System Thermal Design Suggestions
Balanced Technology Extended (BTX) System Design Guide
1.3
Definition of Terms
Table 2.
Terms Used (Sheet 1 of 2)
Term
T
A
T
C
T
E
T
S
T
C-MAX
Ψ
CA
Ψ
CS
October 2007
Order Number: 315279 - 003US
2 Duo E6400, E4300, and Intel
Document
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet for
an active heatsink. Also referred to as T
The case temperature of the processor, measured at the geometric center of the topside of
the IHS.
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets. Also referred to as T
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to T
.
C
The maximum case temperature as specified in a component specification.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (T
Note: Heat source must be specified for Ψ measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface material
performance using total package power. Defined as (T
referred to as Ψ
.
TIM
Note: Heat source must be specified for Ψ measurements.
®
TM
Intel
Core
2 Duo E6400, E4300, and Intel
®
®
Pentium
Dual-Core E2160
Table 1
http://developer.intel.com/
design/processor/designex/
313685.htm
http://developer.intel.com/
design/Pentium4/guides/
302666.htm
http://www.intel.com/design/
processor/datashts/313278.htm
http://www.intel.com/design/
processor/datashts/316981.htm
http://www.intel.com/design/
processor/designex/317804.htm
http://developer.intel.com/
design/Pentium4/guides/
302553.htm
http://www.formfactors.org/
http://www.formfactors.org/
http://www.formfactors.org/
http://www.formfactors.org/
Description
.
LA
EXT
- T
C
- T
C
®
Pentium
may be beneficial
Comment
.
) / Total Package Power.
A
) / Total Package Power. Also
S
®
Dual-Core E2160 Processor
TDG
9
Advertisement
Table of Contents
