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Case Temperature Reference Metrology—Intel
®
Pentium
Dual-Core E2160 Processor
Appendix C Case Temperature Reference Metrology
C.1
Objective and Scope
This appendix defines a reference procedure for attaching a thermocouple to the IHS of
a 775-land LGA package for TC measurement. This procedure takes into account the
specific features of the 775-land LGA package and of the LGA775 socket for which it is
intended. The recommended equipment for the reference thermocouple installation,
including tools and part numbers are also provided. In addition, a video that shows the
process in real time - Thermocouple Attach Using Solder - Video CD-ROM - is available.
For information on case temperature reference setup, tool use, and approach, please
refer to Intel® Core™2 Duo Processor and Intel® Pentium® Dual Core Processor
Thermal and Mechanical Design Guidelines, Appendix D.
October 2007
Order Number: 315279 - 003US
®
TM
Core
2 Duo E6400, E4300, and Intel
®
TM
Intel
Core
2 Duo E6400, E4300, and Intel
®
®
®
Pentium
Dual-Core E2160 Processor
TDG
51
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