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— The height of the package, from the package seating plane to the top of the
IHS, and accounting for its nominal variation and tolerances that are given in
the corresponding processor datasheet.
• Engages easily, and if possible, without the use of special tools. In general, the
heatsink is assumed to be installed after the motherboard has been installed into
the chassis.
• Minimizes contact with the motherboard surface during installation and actuation to
avoid scratching the motherboard.
2.2
Thermal Requirements
Refer to the datasheet for the processor thermal specifications. The majority of
processor power is dissipated through the IHS. There are no additional components,
e.g., BSRAMs, which generate heat on this package. The amount of power that can be
dissipated as heat through the processor package substrate and into the socket is
usually minimal.
The thermal limits for the processor are the Thermal Profile and T
Profile defines the maximum case temperature as a function of power being dissipated.
T
is a specification used in conjunction with the temperature reported by the on-
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die thermal diode and a fan speed control method. Designing to these specifications
allows optimization of thermal designs for processor performance and acoustic noise
reduction.
2.2.1
Processor Case Temperature
For the processor, the case temperature is defined as the temperature measured at the
geometric center of the package on the surface of the IHS. For illustration,
shows the measurement location for a 37.5 mm x 37.5 mm [1.474 in x 1.474 in] 775-
Land LGA processor package with a 28.7 mm x 28.7 mm [1.13 in x 1.13 in] IHS top
surface. Techniques for measuring the case temperature are detailed in Section 3.4.
Note:
In case of conflict, the package dimensions in the processor datasheet supersedes
dimensions provided in this document.
®
TM
Intel
Core
2 Duo E6400, E4300, and Intel
TDG
14
®
TM
Core
2 Duo E6400, E4300, and Intel
®
®
Pentium
Dual-Core E2160 Processor
®
®
Pentium
Dual-Core E2160 Processor—Processor
Thermal/Mechanical Information
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Order Number: 315279 -003US
. The Thermal
Figure 2
October 2007
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