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®
Thermal Metrology—Intel
Processor
Figure 6.
Locations for Measuring Local Ambient Temperature, Passive Heatsink
Note:
Drawing Not to Scale
3.4
Processor Case Temperature Measurement Guidelines
To ensure functionality and reliability, the processor is specified for proper operation
when T
C
measurement location for T
location for T
Special care is required when measuring T
measurement. Thermocouples are often used to measure T
measurements are made, the thermocouples must be calibrated, and the complete
measurement system must be routinely checked against known standards.
When measuring the temperature of a surface that is at a different temperature from
the surrounding local ambient air, errors could be introduced in the measurements. The
measurement errors could be caused by poor thermal contact between the junction of
the thermocouple and the surface of the integrated heat spreader, heat loss by
radiation, convection, by conduction through thermocouple leads, or by contact
between the thermocouple cement and the heatsink base.
Appendix C
775-Land LGA processor package for T
account the specific features of the 775-Land LGA package and of the LGA775 socket
for which it is intended.
October 2007
Order Number: 315279 - 003US
TM
Core
2 Duo E6400, E4300, and Intel
is maintained at or below the thermal profile as listed in the datasheet. The
is the geometric center of the IHS.
C
measurement.
C
defines a reference procedure for attaching a thermocouple to the IHS of a
®
TM
Intel
Core
2 Duo E6400, E4300, and Intel
®
®
Pentium
Dual-Core E2160
to ensure an accurate temperature
C
. Before any temperature
C
measurement. This procedure takes into
C
®
Pentium
Figure 2
shows the
®
Dual-Core E2160 Processor
TDG
25
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