Thermal Metrology; Characterizing Cooling Performance Requirements - Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Design Manual

Thermal design guide
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®
Thermal Metrology—Intel
Processor
3.0

Thermal Metrology

This section discusses guidelines for testing thermal solutions, including measuring
processor temperatures. In all cases, the thermal engineer must measure power
dissipation and temperature to validate a thermal solution. To define the performance
of a thermal solution the "thermal characterization parameter", Ψ ("psi") will be used.
3.1

Characterizing Cooling Performance Requirements

The idea of a "thermal characterization parameter", Ψ ("psi"), is a convenient way to
characterize the performance needed for the thermal solution and to compare thermal
solutions in identical situations (same heat source and local ambient conditions). The
thermal characterization parameter is calculated using total package power.
Note:
Heat transfer is a three-dimensional phenomenon that can rarely be accurately and
easily modeled by a single resistance parameter like Ψ.
The case-to-local ambient thermal characterization parameter value (Ψ
measure of the thermal performance of the overall thermal solution that is attached to
the processor package. It is defined by the following equation, and measured in units of
°C/W:
Equation 1. Ψ
= (T
CA
Where:
Ψ
=
CA
T
=
C
T
=
A
P
=
D
The case-to-local ambient thermal characterization parameter of the processor, Ψ
comprised of Ψ
and of Ψ
SA
Equation 2. Ψ
= Ψ
CA
Where:
Ψ
=
CS
Ψ
=
SA
Ψ
is strongly dependent on the thermal conductivity and thickness of the TIM
CS
between the heatsink and IHS.
October 2007
Order Number: 315279 - 003US
TM
Core
2 Duo E6400, E4300, and Intel
- T
) / P
C
A
D
Case-to-local ambient thermal characterization parameter (°C/W)
Processor case temperature (°C)
Local ambient temperature in chassis at processor (°C)
Processor total power dissipation (W) (assumes all power dissipates
through the IHS)
, the thermal interface material thermal characterization parameter,
CS
, the sink-to-local ambient thermal characterization parameter:
+ Ψ
CS
SA
Thermal characterization parameter of the thermal interface material
(°C/W)
Thermal characterization parameter from heatsink-to-local ambient
(°C/W)
®
TM
Intel
Core
®
®
Pentium
Dual-Core E2160
2 Duo E6400, E4300, and Intel
) is used as a
CA
®
®
Pentium
Dual-Core E2160 Processor
, is
CA
TDG
21

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