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Intel® Reference Thermal Solution—Intel
Dual-Core E2160 Processor
and higher surface temperatures. The system designer needs to account for altitude
effects in the overall system thermal design to make sure that the T
the processor is met at the targeted altitude.
5.5
Geometric Envelope for Intel Reference PICMG 1.3
Thermal Mechanical Design
Figure 20
keep-out information for the reference thermal/mechanical enabling design. These
drawings include height restrictions in the enabling component region.
October 2007
Order Number: 315279 - 003US
®
TM
Core
2 Duo E6400, E4300, and Intel
and
Figure 21
in
Appendix D
®
TM
Intel
Core
2 Duo E6400, E4300, and Intel
®
Pentium
give detailed reference PICMG 1.3 motherboard
®
Pentium
®
requirement for
C
®
Dual-Core E2160 Processor
TDG
37
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