Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Design Manual page 10

Table 2. Terms Used (Sheet 2 of 2)
Term
Ψ
SA
TIM
P
MAX
TDP
IHS
LGA775 Socket
ACPI
Bypass
Thermal Monitor
TCC
T
DIODE
FSC
T
CONTROL
PWM
Health Monitor
Component
TMA
® TM
Intel Core 2 Duo E6400, E4300, and Intel
TDG
10
® TM
Intel Core 2 Duo E6400, E4300, and Intel
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
Note: Heat source must be specified for Ψ measurements.
Thermal Interface Material: The thermally conductive compound between the heatsink and
the processor case. This material fills the air gaps and voids, and enhances the transfer of
the heat from the processor case to the heatsink.
The maximum power dissipated by a semiconductor component.
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
Integrated Heat Spreader: a thermally conductive lid integrated into a processor package
to improve heat transfer to a thermal solution through heat spreading.
The surface mount socket designed to accept the processors in the 775-Land LGA
package.
Advanced Configuration and Power Interface.
Bypass is the area between a passive heatsink and any object that can act to form a duct.
For this example, it can be expressed as a dimension away from the outside dimension of
the fins to the nearest surface.
A feature on the processor that attempts to keep the processor die temperature within
factory specifications.
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the die temperature has exceeded its
operating limits.
Temperature reported from the on-die thermal diode.
Fan Speed Control: Thermal solution that includes a variable fan speed which is driven by
a PWM signal and uses the on-die thermal diode as a reference to change the duty cycle of
the PWM signal.
T is the specification limit for use with the on-die thermal diode.
CONTROL
Pulse width modulation is a method of controlling a variable speed fan. The enabled 4 wire
fans use the PWM duty cycle percent from the fan speed controller to modulate the fan
speed.
Any standalone or integrated component that is capable of reading the processor
temperature and providing the PWM signal to the 4 pin fan header.
Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal
solution.
® ®
Pentium Dual-Core E2160 Processor
® ®
Pentium Dual-Core E2160 Processor—
Description
- T ) / Total Package Power.
S A
§ §
Order Number: 315279 - 003US
Introduction
October 2007