Table of Contents
Advertisement
Intel
Ψ
is a measure of the thermal characterization parameter from the bottom of the
SA
heatsink to the local ambient air.
conductivity, and geometry. It is also strongly dependent on the air velocity through
the fins of the heatsink.
Figure 4
parameters.
Figure 4.
Processor Thermal Characterization Parameter Relationships
Heatsink
Heatsink
Processor
Processor
3.1.1
Example
The cooling performance, Ψ
characterization parameter described above:
• The case temperature T
datasheet.
• Define a target local ambient temperature at the processor, T
Since the processor thermal profile applies to all processor frequencies, it is important
to identify the worst case (lowest Ψ
establish a design strategy.
The following provides an illustration of how one might determine the appropriate
performance targets. The example power and temperature numbers used here are not
related to any specific Intel processor thermal specifications, and are for illustration
purposes only.
Assume the TDP, as listed in the datasheet, is 100 W and the maximum case
temperature from the thermal profile for 100 W is 67° C. Assume as well that the
system airflow has been designed such that the local ambient temperature is 38° C.
Then the following could be calculated using
Ψ
= (T
CA
®
TM
Intel
Core
2 Duo E6400, E4300, and Intel
TDG
22
®
TM
Core
2 Duo E6400, E4300, and Intel
illustrates the combination of the different thermal characterization
TIM
TIM
IHS
IHS
, is then defined using the principle of thermal
CA
C-MAX
,- T
) / TDP = (67 - 38) / 100 = 0.29 °C/W
C
A
®
®
Pentium
Dual-Core E2160 Processor
®
®
Pentium
Dual-Core E2160 Processor—Thermal
SA is dependent on the heatsink material, thermal
T
T
A
A
T
T
S
S
T
T
C
C
and thermal design power TDP given in the processor
) for a targeted chassis characterized by TA to
CA
Equation 1
from above:
Metrology
Ψ
Ψ
CA
CA
LGA775 Socket
LGA775 Socket
System Board
System Board
.
A
October 2007
Order Number: 315279 - 003US
Advertisement
Table of Contents
