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9.1.1.
Height
The height of the module depends on the height of the implemented cooling solution. The height of the cooling
solution is not specified in the COM Express® specification.
The COM Express® specification defines a module height of approximately 13 mm from module PCB bottom to
heatspreader top, as shown in Figure 6: Module Height below.
Figure 6: Module Height
6
5
1.
Heatspreader
2.
Heatspreaader standoff(s)
3.
Module PCB
9.1.2.
Module Height with Four SODIMM Memory Sockets
The overall height of the module and carrier board depends on whether the COMe-bID7 is implemented with:
two SODIMMs both located on module's top side (standard variant)
four SODIMMs with two located on module's top side and bottom side
The COMe-bDV7 variant with four SODIMM memory is outside the basis COM Express® PICMG COM.0 Rev 3.0 Type 7
module form factor and requires the carrier board to be designed to support an 8 mm high COMe connector. To
calculate the total height of the module and carrier take both the top side height and the bottom side height into
consideration.
The 4x SODIMM variant has SODIMM sockets assembled on the bottom side of the module
and requires a carrier board with 8 mm high COMe connectors and a component free area on
the carrier board below the module SODIMM sockets.
The following figure shows the module board with the optional variant SODIMMs assembled on the top side and the
bottom side of the board.
www.kontron.com
4. Carrier Board PCB
5.
Connector standoff(s) 5 mm or 8 mm
6.
13 mm +/- 0.65 mm
COMe-bID7 User Guide Rev. 1.2
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