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3.2. Processors
The Intel® Xeon® processor D-1700 processor family with 45 mm x 45 mm package size (FCBGA) is the next
generation System-on-Chip (SoC) with processor cores built using Intel 10-nanometer process technology. The three
major complexes in this highly-integrated SoC are the CPU, PCH and NAC. The Central Processing Unit (CPU) complex
contains up to 10 next-generation 64-bit processor cores.
The Platform Controller Hub (PCH) of the SoC is architected with a rich set of interconnect technologies.
The Network Accelerator Complex (NAC) includes technologies for security and packet processing.
The SoC architecture is highly scalable and efficient, providing a unified solution across an array of products. The
processor SKUs are targeted for long life supply availability with extended reliability in communications
environments.
Table 4: Intel® Processor D-1700 Product Family Specifications
Intel®
D-1749
D-1747
Process
NT
NTE
or
# of
10
10
Cores
# of
20
20
Threads
Base
3.0
2.5
Freq.
(GHz)
Turbo
3.5
3.5
Fre-
quency
(GHz)
Thermal
90
80
Design
Power
(TDP)
(W)
Instruct.
64 Bit
64 Bit
Set
Cache
15
15
(MB)
Memory
DDR4-
DDR4-
Type
2667
2933
Max
128
128
Memory
Size
(GB)
ECC
Yes
Yes
Memory
www.kontron.com
D-1746
D-1735
D-1732
TR
TER
TE
10
8
8
20
16
16
2.0
2.2
1.9
3.1
3.4
3.0
67
59
52
64 Bit
64 Bit
64 Bit
15
15
15
DDR4-
DDR4-
DDR4-
2667
2933
2667
128
128
128
Yes
Yes
Yes
COMe-bID7 User Guide Rev. 1.2
D-1718T
D-1734
D-1715
TER
NT
8
4
4
16
8
8
2.0
2.4
2.6
3.1
3.5
3.5
50
50
46
64 Bit
64 Bit
64 Bit
15
10
10
DDR4-
DDR4-
DDR4-
2400
2667
2933
128
128
128
Yes
Yes
Yes
D-1712
TR
4
8
2.0
3.1
40
64 Bit
10
DDR4-
2400
128
Yes
// 20
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