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Related Manuals for Kontron COMh-caRP
Summary of Contents for Kontron COMh-caRP
- Page 1 User Guide Rev. 0.2 Preliminary...
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Page 2: Table Of Contents
......................... 3.3.7 High-Speed Interface Overview ..................3.4 Interfaces ..........................3.4.1 PCIe ............................ 3.4.2 USB ............................ 3.4.5 Graphics Interfaces ......................3.4.3 SATA ..........................3.4.6 Audio Interfaces ......................... 3.4.7 UART ..........................3.4.8 General Purpose SPI interface .................... 3.4.9 Boot SPI ..........................www.kontron.com... - Page 3 3.7 Thermal Management ......................3.7.1 Heatspreader Plate Assembly .................... 3.7.2 Active/Passive Cooling Solutions ..................3.7.3 Operating with Kontron Heatspreader Plate (HSP) Assembly ..........3.7.4 Operating without Kontron Heatspreader Plate (HSP) Assembly ........3.7.5 Temperature Sensors ......................3.7.6 On-Module Fan Connector ....................
- Page 4 COMh-caAP User Guide 5.6.1 Startup Scripting ........................ 5.6.2 Create a Startup Script ...................... 5.6.3 Example of Startup Scripts ....................5.7 Firmware Update ........................6. Technical Support ........................6.1 Warranty ..........................6.2 Returning Defective Material ..................... 7. Document Revision ........................www.kontron.com...
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Page 5: General Information
1. General Information 1.1 Disclaimer Kontron would like to point out that the information contained in this user guide may be subject to alteration, particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee on the part of Kontron with respect to technical processes described in the user guide or any product characteristics set out in the user guide. -
Page 6: Intended Use
PHYSICAL OR ENVIRONMENTAL DAMAGE (COLLECTIVELY, “HIGH RISK APPLICATIONS”). You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at your risk. To minimize the risks associated with your products and applications, you should provide adequate design and operating safeguards. -
Page 7: Terms And Conditions
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order Terms & Conditions. Visit https://www.kontron.com/terms-and-conditions. For contact information, refer to the corporate offices contact information on the last page of this user... -
Page 8: Symbols
COMh-caAP User Guide 1.7 Symbols The following symbols may be used in this user guide of COMh-caAP simple Box Info-Box Important-Box Alert-Box Tip-Box Help-Box Todo-Box Download-Box www.kontron.com 4/60... -
Page 9: For Your Safety
COMh-caAP User Guide 1.8 For Your Safety Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life expectancy of your product can be drastically reduced by improper treatment during unpacking and installation. -
Page 10: Lithium Battery Precautions
Dispose of used batteries according to the manufacturer’s instructions. 1.12 General Instructions on Usage In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received from Kontron Support as a special handling instruction, will void your warranty. -
Page 11: Quality And Environmental Management
COMh-caAP User Guide 1.13 Quality and Environmental Management Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with environmental laws, regulations, and other environmentally oriented requirements. For more information regarding Kontron’s quality and environmental responsibilities, visit https://www.kontron.com/en/quality-management. -
Page 12: Introduction
2. Introduction This user guide describes the COM-HPC® Client Size A Computer-On-Module COMh-caAP made by Kontron and focuses on describing the module’s special features. Kontron recommends users to study this user guide before powering on the module. 2.1 Product Naming Clarification COM-HPC®... -
Page 13: Com-Hpc® Client Functionality
COMh-caAP User Guide 2.4 COM-HPC® Client Functionality All Kontron COM-HPC® Client modules contain two 400-pin connector, each of which has 4 rows called A to D on the primary connector and row E to H on the secondary connector. The COM-HPC®... -
Page 14: Product Specification
There are currently no Industrial Temperature Grade Modules available of COMh-caAP. The upcoming generation Intel® Core™ will provide industrial grade temperature SKUs. 3.2 Accessories Accessories are product specific, COM-HPC® specific or general COMe accessories. For more information, contact your local Kontron Sales Representative or Kontron Inside Sales. www.kontron.com 10/60... -
Page 15: Cooling
HCT01-0000-10-0 COM-HPC Client Carrier 10mm COM-HPC Client Carrier with 10mm Connector Height Table 5: Evaluation Carrier from Kontron 3.2.3 SO-DIMM Memory Kontron provided ECC as well as NON-ECC memory modules, please take care, if your module (depending on the used chipset) supports ECC directly. Kontron PN... -
Page 16: Functional Specification
Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Temperature Optional E1: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating E2: NA Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) Table 7: Technical Data www.kontron.com 12/60... -
Page 17: Block Diagram
COMh-caAP User Guide 3.3.2 Block Diagram Figure 1: COMh-caAP Blockdiagram 3.3.3 Front Side Figure 2: COMh-caAP Front Side www.kontron.com 13/60... -
Page 18: Back Side
Intel® Thread Director intelligently directs the OS to match the appropriate workload to the right core. This is the biggest leap in Intel® Core™ processor technology in years, with up to 1.07x faster single-thread performance and up to 1.29x faster multithread performance vs. 11th Gen Intel® Core™ processors. Key features are: www.kontron.com 14/60... - Page 19 (@45W) Up to Up to 18MB Iris® X i5-12600HE Graphics processor (@35W) Intel® Core™ (@45W) Up to Up to Intel® UHD 12MB i3-12300HE Graphics processor (@35W) Table 8: Processor lineup - 12th Gen Intel® Core™ processors (H-series 45W) www.kontron.com 15/60...
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Page 20: System Memory
In general, memory modules have a much lower longevity than embedded motherboards, and therefore the EOL of the memory modules may occur several times during the lifetime of the motherboard. Kontron guarantees to maintain memory modules by replacing EOL memory modules www.kontron.com... -
Page 21: High-Speed Interface Overview
COMh-caAP User Guide with another qualified similar module. As a minimum, it is recommended to use Kontron memory modules for prototype system(s) in order to prove the stability of the system and as a reference. For volume production, if required, test and qualify other types of RAM. In order to qualify RAM it is recommend to configure three systems running a RAM Stress Test program in a heat chamber at... -
Page 22: Interfaces
PCIe15 no NVME PCIEX4_B_TX/RX_±[3] PCIe16 PCIEX8_A_TX/RX_±[0] PCIe17 PCIEX8_A_TX/RX_±[1] PCIe18 PCIEX8_A_TX/RX_±[2] PCIe19 PCIEX8_A_TX/RX_±[3] PCIe20 PCIEX8_A_TX/RX_±[4] PCIe21 PCIEX8_A_TX/RX_±[5] PCIe22 PCIEX8_A_TX/RX_±[6] PCIe23 PCIEX8_A_TX/RX_±[7] Table 14: PCI Express Graphics 4.0 (PEG) The PCIEX8 lanes in Group 1 are only available on H-Series SKUs. www.kontron.com 18/60... -
Page 23: Usb
USB_SS2 USB32_1 3.2 Gen2 x1 (5/10 Gb/s) USB_SS3 USB32_2 3.2 Gen2 x1 (5/10 Gb/s) Table 16: USB 3.2 signals COM-HPC connector ADL P Description USB0 USB2 1 In corresponding with USB_SS0 USB1 USB2 2 In corresponding with USB_SS1 www.kontron.com 19/60... -
Page 24: Graphics Interfaces
Table 19: Display Interfaces on COMh-caAP 3.4.3 SATA Two SATA links for support of SATA-150 (revision 1.0, 1.5Gb/s), SATA-300 (revision 2.0, 3Gb/s), and SATA-600 (revision 3.0, 6Gb/s) devices are defined, for the Client Module and the Server Module. 3.4.6 Audio Interfaces www.kontron.com 20/60... -
Page 25: Uart
PCH's UART. COMh EC (Default) PCH (Optional) UART0_TX UART0_TX GPP_H11/UART0_TXD UART0_RX UART0_RX GPP_H10/UART0_RXD UART0_RTS# UART0_RTS# GPP_H13/UART0_CTS# UART0_CTS# UART0_CTS# GPP_H12/UART0_RTS# UART1_TX UART1_TX GPP_D18/UART1_TXD UART1_RX UART1_RX GPP_D17/UART1_RXD UART1_RTS# UART1_RTS# - UART1_CTS# UART1_CTS# - Table 22: UART interface on COMh-caAP www.kontron.com 21/60... -
Page 26: General Purpose Spi Interface
COMh-caAP supports on-module and external carrier boot from SPI. COMh signals BSEL[1:3] can be used to select the desired boot source (see table below) BSEL eSPI_CS1# eSPI_CS0# SPI_CS1# SPI_CS0# Boot option Description 0 1 2 1 1 1 Carrier Module Module Module MAFS BIOS on SPI0 or SPI1 on Module www.kontron.com 22/60... -
Page 27: Espi
The default speed is 200 kHz. 3.4.12 GPIO The COMh-caAP offers GPIO pins on the dedicated pins of COM-HPC®. The type of termination resistor used sets the direction of the GPIO; where GPI terminations are pull-up resistors, and GPO terminations are pull-down resistors. www.kontron.com 23/60... -
Page 28: Smb
To power on from states S3, S4 and S5 use Power Button WakeOnLAN (S3, S4) The OS must support wake up from an USB device and the carrier board must power the USB port with the standby voltage. www.kontron.com 24/60... -
Page 29: Embedded Controller - Hardware Monitor
WD_OUT is an output indicating that a watchdog time-out event has occurred, when the setting activates this signal. COM-HPC Description Passed through Embedded Controller. WD_OUT GPIO036 Output indicating that a watchdog time-out event has occurred. Passed through Embedded Controller. WD_STROBE# GPIO035 Strobe input to watchdog timer. www.kontron.com 25/60... -
Page 30: Real-Time Clock (Rtc)
PCIEX4_B[0:3] lanes instead of COMh PCIe[12:16] lanes. There are different types of NVMe SSDs available from different vendors. For further information on offered resp. released types and their particular feature set, contact Kontron Support. 3.5.7 Features on Request NVME can be equipped 2nd SPI BIOS flash on-module for failover (not implemented on Standard Modules) -
Page 31: Electrical Specification
OFF for a time long enough to allow the internal board voltages to discharge sufficiently. If the OFF time is not observed, parts of the board or attached peripherals may work www.kontron.com 27/60... -
Page 32: Power Management
If power is removed, 5V can be applied to the V_5V_SBY pins to support the ACPI suspend-states: Suspend to RAM (S3) Suspend to Disk (S4) Soft-off (S5) If power is removed, the wake-up event (S0) requires 12V VCC to power on the module for normal operation. www.kontron.com 28/60... - Page 33 USB devices on the Carrier that are to be active in S5 / S3 / S0 should not have their 5V supply applied before RSMRST_OUT# goes high. RSMRST_OUT# shall be a 3.3V CMOS Module output, active in all power states. Table 30: Power Supply Control Signals www.kontron.com 29/60...
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Page 34: Thermal Management
3.7 Thermal Management 3.7.1 Heatspreader Plate Assembly A heatspreader plate assembly is available from Kontron for the COMh-caAP. The heatspreader plate assembly is NOT a heat sink. The heatspreader plate transfers heat as quickly as possible from the processor using a copper core positioned directly above the processor and a Thermal Interface Material (TIM). -
Page 35: Temperature Sensors
Temperature Sensor in Board Management Controller 3.7.6 On-Module Fan Connector The module's fan connector powers, controls and monitors an external fan. To connect a standard 3- pin connector fan to the module, use Kontron's fan cable, KAB-HSP 200 mm (96079-0000-00-0). www.kontron.com 31/60... - Page 36 Fan_Tach_IN# Fan input voltage from COMe connector Input V_FAN 12 V ±10% (max.) across module input range PWR Power GND Table 32: Fan Connector (3-Pin) Pin Assignment Always check the fan specification according to the limitations of the supply current and supply voltage. www.kontron.com 32/60...
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Page 37: Mechanical Specification
3.8.2 Module Height The COM-HPC specification defines a module height of approximatly 15mm, when measured from the bottom of the module's PCB board to the top of the heatspreader. The overall height of the module and carrier board depends on www.kontron.com 33/60... -
Page 38: Heatspreader Plate Assembly Dimension
93 % @40°C, non-condensing Shock Non-operating shock test (half-sinusoidal, 11ms, 15g) (according to IEC / EN 60068-2-27) Vibration Non-operating vibration (sinusoidal, 10 Hz to 2000 Hz, +/- 0.15 mm, 2 g) (according to IEC / EN 60068-2-6) Table 33: Environmental Specification www.kontron.com 34/60... -
Page 39: Compliance
Table 35: Country Compliance If the product is modified, the prerequisites for specific approvals may no longer apply. Kontron is not responsible for any radio television interference caused by unauthorized modifications of the delivered product or the substitution or attachment of connecting cables and equipment other than those specified by Kontron. -
Page 40: Mtbf
Estimated RTC battery life (as opposed to battery failures) is not accounted for and needs to be considered separately. Battery life depends on both temperature and operating conditions. When the module is connected to external power, the only battery drain is from leakage paths. www.kontron.com 36/60... -
Page 41: Com-Hpc Interface Connector
Failure to disconnect the main power supply could result in personal injury and damage to the module and/or carrier board. Observe that only trained personnel aware of the associated dangers connect the module, within an access controlled ESD-safe workplace. www.kontron.com 37/60... -
Page 42: J1 And J2 Signals
USB 2.0 compliant differential signals. USB_SS USB Super Speed compliant signals; includes USB 3.0, USB 3.1, USB 3.2 and USB4. Table 38: Buffer Types Other Notation Description Pull-Down Pull-Up 2.2 Kohm resistor (and so on for other values) Table 39: Other Notation www.kontron.com 38/60... -
Page 43: Connector J1
A45 eDP_TX2+ eDP Pair 0 + O LV_DIFF — — A46 GND Power Ground PWR GND — — A47 eDP_TX3- eDP Pair 0 - O LV_DIFF — — A48 eDP_TX3+ eDP Pair 0 + O LV_DIFF — — www.kontron.com 39/60... - Page 44 A98 GPIO_10 General purpose input/output 10 I/O-3.3 PU 100k 3.3V (S5) — A99 GPIO_11 General purpose input/output 11 I/O-3.3 PU 100k 3.3V (S5) — A100 TYPE0 Pin-out Type Indication — — Table 40: Connector J1 Pins A1 - A100 www.kontron.com 40/60...
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Page 45: Pins B1 - B100
Clock from Module chipset to Carrier SPI — — B49 BSEL0 Boot Select Pin 0 PU 10k 3.3V (S5) — B50 BSEL1 Boot Select Pin 1 PU 10k 3.3V (S5) — B51 BSEL2 Boot Select Pin 2 PU 10k 3.3V (S5) — www.kontron.com 41/60... - Page 46 B97 GP_SPI_CS2# SPI Chip Select O-3.3 — — B98 GP_SPI_CS3# SPI Chip Select O-3.3 — — B99 GP_SPI_CLK SPI Clock O-3.3 — — B100 GP_SPI_ALERT# SPI Alert (interrupt) I-3.3 — Table 41: Connector J1 Pins B1 - B100 www.kontron.com 42/60...
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Page 47: Pins C1 - C100
O LV_DIFF — — C57 PCIe_REFCLK0_HI+ Reference clock PCIe Group 0 High + O LV_DIFF — — C58 GND Power Ground PWR GND — — C59 PCIe_REFCLK0_LO- Reference clock PCIe Group 0 Low - O LV_DIFF — — www.kontron.com 43/60... -
Page 48: Pins D1 - D100
PWR 8.0-20V — — D10 WAKE0# PCI Express Wake Event I/O-3.3 — D11 WAKE1# General Purpose Wake Event I-3.3 — D12 GND Power Ground PWR GND — — D13 USB1- USB 2.0 Data Pair Port 1 - I/O-3.3 — — www.kontron.com 44/60... - Page 49 D72 GND Power Ground PWR GND — — D73 PCIe04_TX- PCI Express Lane 4 Transmit - Group 0 Low O PCIe — — D74 PCIe04_TX+ PCI Express Lane 4 Transmit + Group 0 Low O PCIe — — www.kontron.com 45/60...
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Page 50: Connector J2
Power Ground PWR GND — — E21 PCIe32_TX- PCI Express Lane 32 Transmit - Group 2 — — E22 PCIe32_TX+ PCI Express Lane 32 Transmit + Group 2 — — E23 GND Power Ground PWR GND — — www.kontron.com 46/60... - Page 51 — E81 NBASET1_LINK_ACT# NBASE-T Ethernet Port 1 controller activity indicator O-3.3 — — E82 NBASET1_LINK_MAX# NBASE-T Ethernet Port 1 MAX speed Link indicator O-3.3 — — E83 GND Power Ground PWR GND — — E84 RSVD — — www.kontron.com 47/60...
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Page 52: Pins F1 - F100
PCI Express Lane 37 Receive - Group 2 — — F36 PCIe37_RX+ PCI Express Lane 37 Receive + Group 2 — — F37 GND Power Ground PWR GND — — F38 PCIe38_RX- PCI Express Lane 38 Receive - Group 2 — — www.kontron.com 48/60... - Page 53 Power Ground PWR GND — — F95 RSVD — — F96 ETH0-1_PRSNT# Ethernet 0/1 Present — — F97 ETH0-1_PHY_RST# Ethernet PHY reset signal — — F98 ETH0_SDP Ethernet 0 SDP — — F99 ETH1_SDP Ethernet 1 SDP — — www.kontron.com 49/60...
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Page 54: Pins G1 - G100
Power Ground PWR GND — — G51 PCIe26_RX- PCI Express Lane 26 Receive - Group 1 — — G52 PCIe26_RX+ PCI Express Lane 26 Receive + Group 1 — — G53 GND Power Ground PWR GND — — www.kontron.com 50/60... -
Page 55: Pins H1 - H100
O USB SS — — Power Ground PWR GND — — USB2_SSTX1- USB Super Speed Pair 2 Transmit 1 - — — USB2_SSTX1+ USB Super Speed Pair 2 Transmit 1 + — — Power Ground PWR GND — — www.kontron.com 51/60... - Page 56 PWR GND — — H65 PCIe31_TX- PCI Express Lane 31 Transmit - Group 1 — — H66 PCIe31_TX+ PCI Express Lane 31 Transmit + Group 1 — — H67 GND Power Ground PWR GND — — H68 RSVD — — www.kontron.com 52/60...
- Page 57 H98 ETH0-1_MDIO_CLK ETH 0-1 clock signal for Management Data I/O interface NA — — H99 ETH0-1_MDIO_DAT ETH 0-1 Management Data I/O interface mode — — H100 PCIe_WAKE_OUT1# PCIe wake request signal Table 47: Connector J2 Pins H1 - H100 www.kontron.com 53/60...
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Page 58: Uefi Bios
COMh-caAP User Guide 5. UEFI BIOS 5.1 Starting the UEFI BIOS The COMh-caAP uses a Kontron-customized, pre-installed and configured version of AMI Aptio® V BIOS based on the Unified Extensible Firmware Interface (UEFI) specification and the Intel® Platform Innovation Framework for EFI. -
Page 59: Navigating The Uefi Bios
Functions displayed in grey provide information about the status or the operational configuration. 5.4 Getting Help The right frame displays a help window. The help window provides an explanation of the respective function. www.kontron.com 55/60... -
Page 60: Uefi Shell
COMh-caAP User Guide 5.5 UEFI Shell The Kontron UEFI BIOS features a built-in and enhanced version of the UEFI Shell. For a detailed description of the available standard shell scripting, refer to the EFI Shell User Guide. For a detailed description of the available standard shell commands, refer to the EFI Shell Command Manual. -
Page 61: Uefi Shell Scripting
Initially searches for Kontron flash-stored startup script If there is no Kontron flash-stored startup script present, then the UEFI-specified startup.nsh script is used. This script must be located on the root of any of the attached FAT-formatted disk... -
Page 62: Technical Support
RMA number. The buyer accepts responsibility for all freight charges for the return of goods to Kontron’s designated facility. Kontron will pay the return freight charges back to the buyer’s location in the event that the equipment is repaired or replaced within the stipulated warranty period. - Page 63 fill out the above information in the RMA Request form for each product. Send the completed RMA-Request form to the fax or email address given below at Kontron Europe GmbH. Kontron will provide an RMA-Number.
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Page 64: Document Revision
COMh-caAP User Guide 7. Document Revision The following table shows the revision of this document. Revision Author Date Comment 2023-04-11 initial preliminary release 2023-05-17 corrected small issues Table 49: Document Revision Table www.kontron.com 60/60...