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3.10.1.
Overview of currently supported LAN Interfaces on COMe-bID7
10GBASE-KR (default configuration) – CEI
Backplane Ethernet (no external PHY required)
Typical chip to chip connection e.g. via backplane or via short direct attach cable
COMe-bID7: LAN config LEK 7.6
Evaluation Platform:
COMe Evaluation Carrier T7 (68300-0000-00-0) – Note: COMe-bID7 must be factory-preconfigured for
COM.0 R3.0 regarding PCI Express support
COMe Evaluation Carrier T7 Gen2 A2T7 (68301-0001-00-8) and expansion card ADA-COMe-T7-G2 4X 10G
DAC (68301-0000-04-4)
10G-SFI (on request) – CEI
Used for optical connection (optical SFP+ modules for multi-mode or single-mode fiber)
SFP+ direct attach (copper cable)
Extra PHY (Intel® C827/XL827) is required on carrier board
COMe-bID7: LAN config LEK 7.0
Evaluation Platform:
COMe Evaluation Carrier T7 Gen2 (68301-0001-00-8) and expansion card ADA-COMe-T7-G2 4x 10G SFP+
C827-IM1 (68301-0000-05-4)
10G-SFI native (on request) – legacy
Used for optical connection (optical SFP+ modules for multi-mode or single-mode fiber)
SFP+ direct attach (copper cable)
COMe-bID7: LAN config LEK 1.0
Evaluation Platform:
COMe Evaluation Carrier T7 (68300-0000-00-0) - Note: COMe-bID7 must be factory-preconfigured for
COM.0 R3.0 regarding PCI Express support
or
COMe Evaluation Carrier T7 Gen2 (68301-0001-00-8) and expansion card ADA-COMe-T7-G2 4X 10G DAC
(68301-0000-04-4) – no PHY
10GBASE-T (on request) – legacy
10 Gbps connection over twisted pair CAT6A cables with distances up to 100 meters
Typical RJ45 connection
Extra PHY (Intel® X557) is required on carrier board
COMe-bID7: LAN config LEK 2.1
Evaluation Platform:
COMe Evaluation Carrier T7 Gen2 (68301-0001-00-8) and expansion card ADA-COMe-T7-G2 4x 10G RJ45
(68301-0000-01-4).
Other 10G LAN configurations are available as well on request, however at this point of time
w/o a corresponding evaluation platform.
www.kontron.com
COMe-bID7 User Guide Rev. 1.2
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