3.8 Mechanical Specification
The COMh-sdID is compatible with the COM-HPC® Server Size D mechanical specification.
3.8.1 Module Dimensions
Figure 8: Module Dimensions
3.8.2 Module Height
The COM-HPC/Server specification defines a module height of approximately 18mm, when measured
from the bottom of the module's PCB board to the top of the heatspreader. The overall height of the
module and carrier board depends on
which carrier board connectors are used (5mm and 10mm height are available)
which cooling solution is used. The height of the cooling solution is not specified in the COM-HPC
specification
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