Kontron COMe-mSP1 User Manual
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Kontron COMe-mSP1 User Manual

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COMe-mSP1
Document Revision 160
www.kontron.com

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Summary of Contents for Kontron COMe-mSP1

  • Page 1 COMe-mSP1 Document Revision 160 www.kontron.com...

  • Page 3: Table Of Contents

    Certifications......................22 MTBF............................24 Mechanical Specification......................25 3.9.1 Module Dimension........................25 3.9.2 Height on Top..........................25 3.9.3 Height on Bottom........................25 3.9.4 Mechanical Drawing........................25 3.10 Thermal Management........................26 3.11 Heatspreader..........................26 Features and Interfaces...............27 Onboard SSD..........................27 LPC............................28 www.kontron.com...
  • Page 4 COMe-mSP1 / boot........................... 29 M.A.R.S............................ 30 Fast I2C & SMBus........................31 JIDA16 and JIDA32........................32 K-Station 1..........................33 K-Station & API Resources......................34 4.8.1 I2C............................34 4.8.2 Storage............................ 34 4.8.3 GPIO............................34 4.8.4 Hardware Monitor........................34 GPIO - General Purpose Input and Output..................35...
  • Page 5 COMe-mSP1 / 6.4.3 Advanced Menu.......................... 71 6.4.4 Advanced PCI/PnP Settings......................91 6.4.5 Boot............................91 6.4.6 Security............................ 94 6.4.7 Advanced Chipset Settings......................94 6.4.8 Exit Menu..........................99...

  • Page 6: User Information

    “as-is” and is subject to change without notice. For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

  • Page 7: Warranty

    This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or replace defective products.

  • Page 8: Introduction

    The COMe-mSP1 with Flash and memory on-board support 1 PCI Express x1 (opt. 2 x1 if no onboard LAN), Serial ATA, High Definition Audio, LVDS and optional SDVO. 10/100/1000 Gigabit Ethernet is designed in onboard for high connectivity and 8x USB provides fast and sufficient interfaces for external peripherals.

  • Page 9: Understanding Com Express® Functionality

    Understanding COM Express® Functionality All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the...

  • Page 10: Com Express® Documentation

    COM Express® Documentation This product manual serves as one of three principal references for a COM Express® design. It documents the specifications and features of COMe-mSP1. Additional references are are available from your Kontron Support or from PICMG®: » The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document is available from the PIGMG website by filling out the order form.

  • Page 11: Product Specification

    3 Product Specification Modules & Accessories The COM Express® mini sized Computer-on-Module COMe-mSP1 (NOW1) follows pin-out Type 1 and is compatible to PICMG specification COM.0 Rev 1.0. The COMe-mSP1, based on Intel's eMenlow platform, is available in different variants to cover the demand of different performance, price and power: Commercial grade modules (0°C to 60°C operating)
  • Page 12 HSP COMe-mSP1 thread 34001-0000-99-1 HSP COMe-mSP1 through 34001-0000-99-2 HSP COMe-mSP1 slim thread 34001-0000-99-0CO1 HSK COMe-mSP1 slim passive thread 34099-0000-99-0 COMe mini Active Uni Cooler (for CPUs up to 10W) 34099-0000-99-1 COMe mini Passive Uni Cooler (for CPUs up to 5W) 34099-0000-99-2...

  • Page 13: Functional Specification

    COMe-mSP1 / Product Specification Functional Specification Processor The Intel® ATOM™ (Silverthorne) CPU family supports: » Intel® Hyper-Threading Technology » Intel® Virtualization Technology (VT-x) » Idle States » Enhanced Intel SpeedStep® Technology » Intel® Demand Based Switching » Thermal Monitoring Technologies »...
  • Page 14 COMe-mSP1 / Product Specification Graphics Core The integrated Intel® GMA 500 based on PowerVR SGX535 core supports: Graphics Core Render Clock 200MHz, , Execution Units / Pixel Pipelines Max Graphics Memory 352MB GFX Memory Bandwidth (GB/s) GFX Memory Technology DVMT API (DirectX/OpenGL) 9.0c / 2.0...
  • Page 15 COMe-mSP1 / Product Specification Connectivity 8x USB 2.0 USB Client 1x USB Client (USB #7) PCI External Masters PCI Express 1x PCIe x1 Gen1 Max PCI Express 2x PCIe x1 without LAN PCI Express x2/x4 configuration Ethernet 10/100/1000 Mbit Ethernet controller Intel®...
  • Page 16 COMe-mSP1 / Product Specification Power Consumption and Performance Full Load Power Consumption 4.9 - 6.2W Kontron Performance Index 1108 - 1687 Kontron Performance/Watt 225 - 273 Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics and Memory performance are available in Application Note...

  • Page 17: Block Diagram

    COMe-mSP1 / Product Specification Block Diagram...

  • Page 18: Electrical Specification

    » Maximum 100 mV peak to peak 0 – 20 MHz 3.4.4 Power Consumption The maximum Power Consumption of the different COMe-mSP1 variants is 4.9 - 6.2W (100% CPU load on all cores; 90°C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available EMD Customer...

  • Page 19: Atx Mode

    COMe-mSP1 / Product Specification 3.4.5 ATX Mode By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion.

  • Page 20: Power Control

    COMe-mSP1 / Product Specification Power Control Power Supply The COMe-mSP1 supports a power input from 4.75 - 14V. The supply voltage is applied through the VCC pins (VCC) of the module connector. Power Button (PWRBTN#) The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms ≤...

  • Page 21: Environmental Specification

    COMe-mSP1 / Product Specification Environmental Specification 3.6.1 Temperature Specification General Specification Operating Non-operating Commercial grade 0°C to +60°C -30°C to +85°C Extended (E1) -25°C to +75°C -30°C to +85°C Industrial grade (E2) -40°C to +85°C -40°C to +85°C Standard modules are available for commercial grade temperature range. Please see...

  • Page 22: Standards And Certifications

    COMe-mSP1 / Product Specification Standards and Certifications RoHS The COMe-mSP1 is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment. CE marking The COMe-mSP1 is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950 Component Recognition UL 60950-1 The COM Express®...
  • Page 23 The COM Express® mini form factor Computer-on-Modules successfully passed shock and vibration tests according to » IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g) » IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g) Validated in Kontron reference housing for EMC the COMe-mSP1 follows the requirements for electromagnetic compatibility standards » EN55022...

  • Page 24: Mtbf

    Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered for separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths.

  • Page 25: Mechanical Specification

    COMe-mSP1 / Product Specification Mechanical Specification 3.9.1 Module Dimension » 55mm x 84mm (±0.2mm) 3.9.2 Height on Top » Maximum approx. 3.5mm (withouth printed circuit board) » Height is depending on (optional) CPU cooler / heat spreader 3.9.3 Height on Bottom »...

  • Page 26: Thermal Management

    Thermal Management A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-mSP1. The heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or other cooling device.

  • Page 27: Features And Interfaces

    4 Features and Interfaces Onboard SSD The COMe-mSP1 features an onboard Greenliant PATA NAND flash drive with capacities of 512MB to 8GB SLC (PATA). Due to performance and longevity reasons standard variants with onboard flash use SLC type only. The following PATA NANDrives...

  • Page 28: Lpc

    LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations. All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:...

  • Page 29: Lpc Boot

    COMe-mSP1 / Features and Interfaces LPC boot The COMe-mSP1 supports boot from an external Firmwarehub on LPC bus (LPC FWH). The external LPC FWH can be activated with signal A34 “BIOS_DISABLE#” or according newer specifications “BIOS_DIS0#” in following configuration: BIOS_DIS0#...

  • Page 30: M.a.r.s

    COMe-mSP1 / Features and Interfaces M.A.R.S. The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g. Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery information to the Operating System.

  • Page 31: Fast I2C & Smbus

    Fast I2C & SMBus The COMe-mSP1 integrates two configurable I2C buses. The external I2C provided via US15W GPIOs on COM Express® Connector Pin B33/B34, the LVDS I2C from US15W SCH is available on COM express® connector pin A83/A84. The I2C interface offers full MultiMaster and Clock Stretching support.

  • Page 32: Jida16 And Jida32

    COMe-mSP1 / Features and Interfaces JIDA16 and JIDA32 JIDA16 (JUMPtec® Intelligent Device Architecture) is a BIOS interface which allows programs running in Real Mode operating systems (i.e. MS DOS) to call certain functions implemented in the BIOS. These functions can be used to get module information, make settings and access the I2C Bus and the Watchdog unit.

  • Page 33: K-Station 1

    Based on the JIDA32 interface users can implement advanced board functionality in their application. As an example utility Kontron provides K-Station for most 32bit Windows Operating Systems. K-Station 1 is a summary of command line utilities (Shell Tools) for easy access to JIDA32 BIOS implementations. Second part of K-Station is a JAVA based example GUI which gives a view an all available features using the Shell Tools.

  • Page 34: K-Station & Api Resources

    COMe-mSP1 / Features and Interfaces K-Station & API Resources 4.8.1 Function I2C 0 External / JIDA I2C I2C 1 SM-Bus I2C 2 SDVO DDC I2C 3 JILI DDC 4.8.2 Storage Device Function EEPROM 0 JIDA EEPROM Area1 with 32 Bytes (free to use) 4.8.3...

  • Page 35: Gpio - General Purpose Input And Output

    COMe-mSP1 / Features and Interfaces GPIO - General Purpose Input and Output The offers 4 General Purpose Input (GPI) pins and 4 General Purpose Output (GPO) pins. On a 3.3V level digital in- and outputs are available. Signal Description GPI0...

  • Page 36: Watchdog Timer

    You can program the timeout period for the watchdog timer in two ranges: » 1-second increments from 1 to 255 seconds » 1-minute increments from 1 to 255 minutes Contact Kontron Embedded Modules technical support for information on programming and operating the WDT.

  • Page 37: Flash Backup Feature

    Flash Backup Feature The COMe-mSP1 supports a new functionality called “Flash Backup”. This new feature allows saving custom defaults directly into the Flash. With invalid EEPROM data or without a CMOS EEPROM, the module will start up with these custom defaults.
  • Page 38 Windows OS c:\>kflash.exe flash biosname.rom /bncr c:\>afudos.exe biosname.rom /p /b /n /c c:\>jidacmos.exe eep /clean kflash.exe is a shell tool included in Kontron K-Station System Utility Package. jidacmos utility is included in the BIOS download packages at Kontron's customer section.

  • Page 39: Speedstep Technology

    COMe-mSP1 / Features and Interfaces 4.12 Speedstep Technology The Intel® processors offers the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum performance mode and battery-optimized mode, depending on the needs of the application being run. It let you customize high performance computing on your applications. When powered by a battery or running in idle mode, the processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining a high level of performance.

  • Page 40: C-States

    COMe-mSP1 / Features and Interfaces 4.13 C-States New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode. Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

  • Page 41: Hyper Threading

    COMe-mSP1 / Features and Interfaces 4.14 Hyper Threading Hyper Threading (officially termed Hyper Threading Technology or HTT) is an Intel®-proprietary technology used to improve parallelization of computations performed on PC´s. Hyper-Threading works by duplicating certain sections of the processor—those that store the architectural state but not duplicating the main execution resources. This allows a Hyper- Threading equipped processor to pretend to be two “logical”...

  • Page 42: Acpi Suspend Modes And Resume Events

    COMe-mSP1 / Features and Interfaces 4.15 ACPI Suspend Modes and Resume Events The COMe-mSP1 supports the S3 state (=Save to Ram). S4 (=Save to Disk) is not supported by the BIOS (S4_BIOS) but S4_OS is supported by the following operating systems: » Windows XP »...

  • Page 43: Usb

    COMe-mSP1 / Features and Interfaces 4.16 The USB interface comes with three USB controllers (6 USB ports). The USB configuration of the COMe-mSP1 module is described in the following table: COM Express Port SCH US15W Port Description USB0 USB0 USB 2.0 compliant...

  • Page 44: Sdio

    COMe-mSP1 / Features and Interfaces 4.17 SDIO The SD card standard is a standard for removable memory storages designed and licensed by the SD Card Association (http://sdcard.org). The card form factor, electrical interface, and protocol are all part of the SD Card specification. The Intel®...

  • Page 45: Graphics Interface

    4.18 Graphics Interface The COMe-mSP1 uses the graphics accelerator GMA500 with 200MHz GPU clock integrated in the Intel® System Controller Hub (US15W), which delivers shader-based technologies and high-performance 2D, 3D and video capabilities. The GMA500 graphics engine supports a variety of LCD panels with single clock, color depths of 18/24 bit and resolutions up to WXGA (1366×768).
  • Page 46 COMe-mSP1 / Features and Interfaces The nanoETXexpress-SP graphics subsystem GMA500 integrated in the Intel® System Controller Hub US15W does not support VGA output. LVDS Flat Panel Interface (JILI) The user interface for flat panels is the JUMPtec Intelligent LVDS Interface (JILI). The implementation of this subsystem complies with the COM Express®...

  • Page 47: Lpc Bus

    COMe-mSP1 / Features and Interfaces 4.19 LPC Bus The Low Pin Count Interface signals are connected to the LPC Bus bridge, which is located in the Intel® US15W system controller hub. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines legacy-device support into a single IC.
  • Page 48 COMe-mSP1 / Features and Interfaces Zero Delay Clock Buffer Do not use the reference schematic in the COM Express Design Guide. Either use another Clock Buffer solution without a long start up process or use series resistors to double the LPC clock line.

  • Page 49: System Resources

    COMe-mSP1 / System Resources 5 System Resources Interrupt Request (IRQ) Lines Please be aware that an ACPI OS decides itself on resource usage. The tables below show only an example distribution. 5.1.1 In 8259 PIC Mode IRQ# Used For Available...

  • Page 50: In Apic Mode

    COMe-mSP1 / System Resources 5.1.2 In APIC mode IRQ# Used For Available Comment Timer 0 Keyboard Slave 8259 External SIO - COM2 Yes (No) Note (1) External SIO - COM1 Yes (No) Note (1) for PCI Dynamic (BIOS default) External SIO...

  • Page 51: Memory Area

    COMe-mSP1 / System Resources Memory Area The first 640 kB of DRAM are used as main memory. Using DOS, you can address 1 MB of memory directly. Memory area above 1 MB (high memory, extended memory) is accessed under DOS via special drivers such as HIMEM.SYS and EMM386.EXE, which are part of the operating system.

  • Page 52: Peripheral Component Interconnect (Pci) Devices

    COMe-mSP1 / System Resources Peripheral Component Interconnect (PCI) Devices All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) respectively the PCI Express Base 1.0a specification. The BIOS and OS control memory and I/O resources. Please see the PCI 2.3 specification for details.

  • Page 53: Pinout List

    COMe-mSP1 / System Resources Pinout List 5.9.1 General Signal Description Type Description I/O-3,3 Bi-directional 3,3 V IO-Signal I/O-5T Bi-dir. 3,3V I/O (5V Tolerance) I/O-5 Bi-directional 5V I/O-Signal I-3,3 3,3V Input Bi-directional Input/Output Open Drain I/OD I-5T 3,3V Input (5V Tolerance)

  • Page 54: Connector X1A Row A

    COMe-mSP1 / System Resources 5.9.2 Connector X1A Row A Signal Description Type Termination (CE 4.x.x) Comment GND_1 Power Ground GBE0_MDI3- Ethernet Receive Data- DP-I GBE0_MDI3+ Ethernet Receive Data+ DP-I GBE0_LINK100# Ethernet Speed LED 100Mbps O-3.3 GBE0_LINK1000# Ethernet Speed LED 1000Mbps O-3.3...
  • Page 55 COMe-mSP1 / System Resources 3.3V PCIE_TX1+ PCIe lane #1 Transmit+ DP-O PU 50R inUS15W only available on no-LAN var. PCIE_TX1- PCIe lane #1 Transmit- DP-O PU 50R inUS15W only available on no-LAN var. GND_9 Power Ground SDIO_D2 / GPI2 SDIO#0 Data2 / General Purpose Input 2 I/O-3.3 / I-3.3...

  • Page 56: Connector X1A Row B

    COMe-mSP1 / System Resources 5.9.3 Connector X1A Row B Signal Description Type Termination (CE 4.x.x) Comment GND_16 Power Ground GBE0_ACT# Ethernet Activity LED LPC_FRAME# LPC Frame Indicator O-3.3 LPC_AD0 LPC Address / Data Bus IO-3.3 PU 20k in US15W LPC_AD1 LPC Address / Data Bus IO-3.3...
  • Page 57 COMe-mSP1 / System Resources SDIO_CD# / GPO3 SDIO#0 CardDetect / General Purpose Output 3 I-3.3 / O-3.3 PU 10k 3.3V / PD 100k - / - PCIE_RX1+ PCIe lane #1 Receive+ DP-I PD 50R inUS15W only available on no-LAN var.

  • Page 58: Sdvo Connector J1801 (Optional)

    COMe-mSP1 / System Resources 5.9.4 SDVO Connector J1801 (optional) With hardware revision CE 4.x.x or newer the COMe-mSP1 provides an optional Serial DVO graphics output via onboard flat foil connector J1801. Signal Description Type Termination Comment GND#1 Ground SDVOB_CLK_N Serial Digital Video Channel B Clock-...

  • Page 59: Xdp Connector J1400 (Optional)

    COMe-mSP1 / System Resources 5.9.5 XDP Connector J1400 (optional) The COMe-mSP1 provides the XDP debug port of Silverthorne CPU optionally with connector J1400. The debug port is for internal use only. Do not connect any devices.

  • Page 60: Bios Operation

    » Kontron® BIOS Version <NOW1RXXX » Copyright 2002-2011 Kontron Embedded Modules GmbH BIOS Update Kontron provides continous BIOS updates for Computer-on-Modules. The updates are provided for download on http://emdcustomersection.kontron.com with a detailed change description within the according Product Change Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.

  • Page 61: Setup Guide

    COMe-mSP1 / BIOS Operation Setup Guide The AMIBIOS Setup Utility changes system behavior by modifying the BIOS configuration. The setup program uses a number of menus to make changes and turn features on or off. Functional keystrokes in POST: Function...
  • Page 62 COMe-mSP1 / BIOS Operation Menu Bar The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection. Legend Bar Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below describes the legend keys and their alternates.

  • Page 63: Bios Setup

    COMe-mSP1 / BIOS Operation BIOS Setup 6.4.1 Main Menu Feature Option Description System Time [hh:mm:ss] <Tab>, <Shift-Tab>, or <Enter> selects field System Date [mm-dd-yyyy] <Tab>, <Shift-Tab>, or <Enter> selects field...

  • Page 64: Module Info

    COMe-mSP1 / BIOS Operation 6.4.2 Module Info Module Component Steppings...
  • Page 65 COMe-mSP1 / BIOS Operation Module Software Revisions Memory Module Information...
  • Page 66 COMe-mSP1 / BIOS Operation Slot 1 Current Memory Configuration SLOT1 shows information of onboard system memory stored in SPD. The SPD EEPROM is supported with CE 4.x.x (PCB L140) or newer. Current LVDS Configuration...
  • Page 67 COMe-mSP1 / BIOS Operation 6.4.3 Advanced Menu...
  • Page 68 COMe-mSP1 / BIOS Operation CPU Configuration Feature Option Description Max CPUID Value Limit Disabled Disabled for WindowsXP Enabled Intel® Virtualization Tech Enabled When enabled, a VMM can utilize the additional HW Caps, provided by Intel® Virtualization Tech. Note: A Disabled full reset is required to change the setting.
  • Page 69 COMe-mSP1 / BIOS Operation IDE Configuration Feature Option Description IDE Controller Enabled Enables or disables the IDE interface of US15W SCH. Disabled This concerns the onboard SSD and PATA2SATA brdige. Hard Disk Write Protect Disabled Disables/enables device write protection. It will be...
  • Page 70 COMe-mSP1 / BIOS Operation IDE Device Submenu Feature Option Description Type Not Installed Selects the type of the IDE Devices connected to the system Auto CD/DVD ARMD LBA/Large Mode Disabled Disables the LBA mode or enables it, when a device...

  • Page 71: Advanced Menu

    COMe-mSP1 / BIOS Operation SDIO Configuration Feature Option Description SD Card Select SDIO or GPIO The SD card interface is shared with module GPIO signals. To use GPIO with this module it is necessary to GPIO set this switch to GPIO.
  • Page 72 COMe-mSP1 / BIOS Operation LPC I/O Controller Configuration Feature Option Description Serial Port1 Address Disabled Selects the Address of COM Port 1 3F8/IRQ4 2F8/IRQ3 3E8/IRQ4 2E8/IRQ3 Serial Port2 Address Disabled Selects the Address of COM Port 2 3F8/IRQ4 2F8/IRQ3 3E8/IRQ4...
  • Page 73 COMe-mSP1 / BIOS Operation ACPI Configuration Feature Option Description ACPI Version ACPI v.3.0 Selects the ACPI version ACPI v.2.0 ACPI APIC support Enabled Include ACPI APIC table pointer to RSDT pointer list. Disabled Repost Video on S3 Resume If yes, Videobios is reinitialized after S3 Resume...
  • Page 74 COMe-mSP1 / BIOS Operation ACPI Cooling Options Feature Option Description Passive Trip Point Disabled This value controls the temperature of the ACPI Passive Trip Point - the point in which the OS will begin 40°C throttling the CPU. 45°C 50°C …...
  • Page 75 COMe-mSP1 / BIOS Operation Passive Cooling The ACPI OS assesses the optimum CPU performance change necessary to lower the temperature using the following equation ?P[%] = TC1(Tn-Tn-1) + TC2(Tn-Tt) ?P is the performance delta, Tt is the target temperature = passive cooling trip point. The two coefficients TC1 and TC2 and the sampling period TSP are hardware dependent constants the end user must supply.
  • Page 76 COMe-mSP1 / BIOS Operation Miscellaneous Settings Feature Option Description Spread Spectrum Disabled Enables or Disables spread spectrum for the selected Clocks. LVDS LVDS: Enables LVDS Spread Spectrum Core Core: Enables CPU, PCIe, Chipset Spread Spectrum Both A20 line controlled by...
  • Page 77 COMe-mSP1 / BIOS Operation I2C Buses Feature Option Description JIDA I2C Bus Speed Very high Select speed for JIDA/external I2C bus. See speed table High in chapter Fast I2C. Medium Slow Very slow Ultra Slow Multi Master support Enabled Enables / disables I2C multi master support...
  • Page 78 COMe-mSP1 / BIOS Operation Watchdog Feature Option Description Mode Reset Selects the mode of the watchdog Disabled Timeout Set the timout for Watchdog 1:00m 5:00m 10:00m...
  • Page 79 COMe-mSP1 / BIOS Operation MARS Interface Configuration Feature Option Description MARS Disabled Enables the MARS function Auto SMB Charger SMB Manager...
  • Page 80 COMe-mSP1 / BIOS Operation Ethernet Configuration Feature Option Description Onboard Gigabit Ethernet Disabled Disables / Enables the onboard Ethernet interface Enabled PXE ROM Disabled Disables / Enables the PXE Boot ROM Enabled...
  • Page 81 COMe-mSP1 / BIOS Operation PCIExpress Configuration Feature Option Description PCIe Ports Both Disables or enables according PCI Express lanes. Onboard Gigabit Ethernet is connected to Port 1. Disabled Port 0/1: enables specific PCI Express Lane Port 0 Both: Both PCI Express lanes from US15W SCH are...
  • Page 82 COMe-mSP1 / BIOS Operation Trusted Computing Feature Option Description TCG/TPM SUPPORT Enable/Disable TPM TCG (TPM 1.1/1.2) support in BIOS...
  • Page 83 COMe-mSP1 / BIOS Operation USB Configuration Feature Option Description Legacy USB Support Disabled Enables / disables support for legacy USB. Enabled USB 2.0 Controller Mode FullSpeed Configures the USB 2.0 controller in HiSpeed HiSpeed (480Mbps) or FullSpeed (12Mbps) BIOS EHCI Hand-Off...
  • Page 84 COMe-mSP1 / BIOS Operation USB Mass Storage Device Configuration Feature Option Description USB Mass Storage Reset Delay 10 Sec Number of seconds POST waits for the USB mass storage 20 Sec device after start unit command. 30 Sec 40 Sec...
  • Page 85 COMe-mSP1 / BIOS Operation Hardware Health Configuration Feature Option Description Module HWM: Disabled Enables the onboard Hardware Health Monitoring H/W Health Function Enabled Device CPU Temperature: CPU ACPI temperature Module Temperature: Internal temperature of HWM Chipset Sensor #1 / Chipset Sensor #2: Internal thermal sensors of US15W SCH to cause main memory throttling and display refresh throttling.
  • Page 86 COMe-mSP1 / BIOS Operation 6.4.4 Advanced PCI/PnP Settings Feature Option Description Clear NVRAM Clear NVRAM once during next system boot. PCI Latency Timer Value in units of PCI clocks for PCI device latency register … PCI IDE BusMaster Disabled Disables and enables PCI IDE Busmaster Enabled IRQ3 …...

  • Page 87: Boot

    COMe-mSP1 / BIOS Operation 6.4.5 Boot...
  • Page 88 COMe-mSP1 / BIOS Operation Boot Setting Configuration Feature Option Description Dark Boot Disabled Disabled: Shows normal POST messages Enabled: Shows OEM Logo during boot up Enabled AddOn ROM Display Mode Force BIOS Set Display Mode for Option ROM Keep Current...
  • Page 89 COMe-mSP1 / BIOS Operation USB Bootable Port Configuration Feature Option Description Port 0 - 7 Disabled Enables/Disables a specific port to be bootable Enabled...

  • Page 90: Security

    COMe-mSP1 / BIOS Operation 6.4.6 Security Feature Option Description Change Supervisor Password Type in Change User Password Type in Boot Sector Virus Protection Disabled Enables or disables boot sector virus protection. Enabled...

  • Page 91: Advanced Pci/Pnp Settings

    COMe-mSP1 / BIOS Operation 6.4.7 Advanced Chipset Settings...
  • Page 92 COMe-mSP1 / BIOS Operation Graphic Controller Configuration Feature Option Description Primary Graphic Adapter PCIe/Onboard Selects which graphics controller is used as primary boot device (boot sequence) Onboard Onboard Graphic Mode Disabled Selects the amount of pre-allocated system memory Enabled, 1MB...
  • Page 93 COMe-mSP1 / BIOS Operation Display Control Feature Option Description Boot Display Device Auto Select the Boot Display Device. Note: SDVO is not supported on HW Rev CE 1.x.x (PCB LVDS L130) SDVO-CRT SDVO-DVI/HDMI...
  • Page 94 COMe-mSP1 / BIOS Operation Internal LVDS Configuration Feature Option Description Flat Panel Mode Auto Selects the Mode for the flat panel detection Fixed Mode PAID FPID Auto Fallback Disabled Selects what happens, when there is no EEPROM Fixed Mode detected (only when FPM: Auto) Flat Panel Type VGA 640×480...
  • Page 95 COMe-mSP1 / BIOS Operation System Controller Hub Configuration Feature Option Description USB UHCI Controller Disabled Enables / Disables USB ports 2 USB Ports 4 USB Ports … 8 USB Ports USB EHCI Controller Enabled Controls EHCI (USB 2.0) functionality for all the UHCI...

  • Page 96: Exit Menu

    COMe-mSP1 / BIOS Operation 6.4.8 Exit Menu Feature Description Save To RTC/EEPROM and Exit Saving system setup to RTC and EEPROM and exit setup. F10 key can be used for this operation Save As Custom Defaults To RTC/Flash and Exit Saving system setup as custom defaults to RTC and Flash and exit setup.
  • Page 97 COMe-mSP1 / BIOS Operation Corporate Offices Europe, Middle East & Africa North America Asia Pacific Oskar-von-Miller-Str. 1 14118 Stowe Drive 17 Building,Block #1,ABP. 85386 Eching/Munich Poway, CA 92064-7147 188 Southern West 4th Ring Germany Beijing 100070, P.R.China Tel.: +49 (0)8165/ 77 777 Tel.: +1 888 294 4558...

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