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5/ Accessories
5.1. Product Specific Accessories
Table 18: Product Specific Accessories List
Product Number
Standard
68300-0000-00-0
68301-0001-00-8
68301-0000-00-8
Available on request
68301-0001-00-5
68301-0000-00-5
Product Number
68301-0000-01-4
68301-0000-04-4
68301-0000-05-4
Table 19: Cooler and Heatspreader
Product Number
68009-0000-99-0
68009-0000-99-1
38025-0000-99-
0C05
38025-0000-99-
0C06
www.kontron.com
Carrier
COMe Eval Carrier T7
COMe Eval Carrier T7 G2-8 R3.1
COMe Eval Carrier T7 G2-8 R3.0
COMe Eval Carrier T7 G2-5 R3.1
COMe Eval Carrier T7 G2-5 R3.0
AdapterCards to be used with
COMe Eval Carrier T7 G2
ADA-COMe-T7-G2 4x 10G RJ45 -
DEV-TOOL
ADA-COMe-T7-G2 4X10G DAC -
DEV-TOOL
ADA-COMe-T7-G2 4x10G SFP+ -
C827-IM1 – DEV-TOOL
Product
HSP COMe-bID7 (E2) threaded
mounting holes
HSP COMe-bID7 (E2) through
holes
HSK COMe-basic active (w/o
HSP)
HSK COMe-basic passive (w/o
HSP)
COMe-bID7 User Guide Rev. 1.2
Description
COM Express® Eval Carrier Type 7
COM Express® Eval Carrier Type 7 Gen2, 8 mm
stack-up, according COM.0 Rev 3.1
COM Express® Eval Carrier Type 7 Gen2, 8 mm
stack-up, according COM.0 Rev 3.0
COM Express® Eval Carrier Type 7 Gen2, 5 mm
stack-up, according COM.0 Rev 3.1
COM Express® Eval Carrier Type 7 Gen2, 5 mm
stack-up, according COM.0 Rev 3.0
Description
4x RJ45: 10GBASE-KR-to-10GBASE-T via 2x Intel
PHY X557-AT2
4x DAC: 10GBASE-KR signals directly routed from
COMe connector to SFP+ cages
4x SFP+: 10GBASE-KR-to-SFI via Intel PHY C827-
IM1
Description
Heatspreader for COMe-bID7 (E2), with Cu-core,
threaded mounting holes
Heatspreader for COMe-bID7 (E2), with Cu-core,
through holes
Active Cooler for COMe-bID7 to be mounted on
HSP
Passive Cooler for COMe-bID7 to be mounted on
HSP
// 36
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