Appendix: Terminology - Kontron COMe-bID7 User Manual

Appendix: Terminology

Term Definition
Advanced Configuration Power Interface – standard to implement power saving modes in PCAT
ACPI systems
Basic Module COM Express® 125mm x 95mm Module form factor.
BIOS Basic Input Output System – firmware in PC-AT system that is used to initialize system
components before handing control over to the operating system.
Carrier Board An application specific circuit board that accepts a COM Express® Module.
COM Express® 95x95 Module form factor
Compact
Module
DDI Digital Display Interface – containing DisplayPort, HDMI/DVI and SDVO
DIMM Dual In-line Memory Module
DRAM Dynamic Random Access Memory
EAPI Embedded Application Programming Interface Software interface for COM Express® specific
industrial functions
System information
Watchdog timer
I2C Bus
Flat Panel brightness control
User storage area
GPIO
EEPROM Electrically Erasable Programmable Read-Only Memory
COM Express® 155mm x 110mm Module form factor.
Extended
Module
Gb Gigabit
GbE Gigabit Ethernet
GPI General Purpose Input
GPIO General Purpose Input Output
GPO General Purpose Output
I2C
Inter Integrated Circuit – 2 wire (clock and data) signaling scheme allowing communication
between integrated circuits, primarily used to read and load register values.
IIO Integrated Input Output
LPC Low Pin-Count Interface: a low speed interface used for peripheral circuits such as Super I/O
controllers, which typically combine legacy-device support into a single IC.
ME Management Engine
Mini Module COM Express® 84x55mm Module form factor
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COMe-bID7 User Guide Rev. 1.2
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