COMh-caRP User Guide
3.8 Mechanical Specification
The COMh-caRP is compatible with the COM-HPC® mechanical specification.
3.8.1 Module Dimensions
Figure 6: Module Dimensions
3.8.2 Module Height
The COM-HPC specification defines a module height of approximatly 15mm, when measured from the
bottom of the module's PCB board to the top of the heatspreader. The overall height of the module
and carrier board depends on
www.kontron.com
33/60