Heat Dissipation From The Periphery (Including The Casing) - Renesas R-IN32M4-CL3 User Manual

R-IN32M4-CL3 User's Manual: Board design edition
8.2.2

Heat Dissipation from the Periphery (Including the Casing)

(1) Incorporating a Heat Sink
Incorporating a heat sink increases the area for heat dissipation, making heat dissipation from the surface of the device
more efficient.
(2) Heat Conduction to the Casing
Placing heat dissipating gel on the surface of the device and connecting this to the metal surface of the casing increases
the efficiency of heat dissipation from the surface of the device.
(3) Placing a Fan in the Casing
Including a fan improves thermal conductivity through convection, which decreases the ambient temperature.
(4) Obtaining a Chimney Effect
Since heat tends to be released in the z direction, placing the board vertically leads to heat convection from the surface of
the device, improving the thermal conductivity rate there.
(5) Enlarging Ventilation Holes
Larger ventilation holes accelerate the heat exchange between the air within the casing and that outside, lowering the
temperature in the vicinity of the device.
(6) Thermal Insulation by Shielding Plates
If there is a particular source of much heat within the casing, thermal insulation by using shielding plates is effective.
Shielding the device from the effects of such heat sources reduces the effect of the heat on the device.
R18UZ0074EJ0100
Dec 24, 2019
8. Thermal Design
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