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Figure 9.14 Connection Example with 16-Bit SRAM (Synchronous Burst Access MEMC) .................................... 43
Figure 9.15 Connection Example with 32-Bit Paged ROM (Synchronous Burst Access MEMC) ............................ 44
Figure 9.16 Connection Example with 16-Bit Paged ROM (Synchronous Burst Access MEMC) ............................ 44
Figure 10.1 Connection Example with Serial Flash ROM ......................................................................................... 45
Figure 11.1 Connection Example between R-IN32M4-CL3 and UART Device ....................................................... 46
2
C Slave Device ................................................... 47
Figure 13.1 Connection Example between R-IN32M4-CL3 and CAN Transceiver .................................................. 48
Figure 14.1 Direct Master/Slave Connection ............................................................................................................. 49
Figure 14.2 Connection between One Master and Two Slaves .................................................................................. 49
Figure 15.1 Connection Example of JTAG Interface (20-Pin Half-Pitch without Trace) .......................................... 50
Figure 15.2 Connection Example of JTAG Interface (20-Pin Half-Pitch with Trace) ............................................... 51
Figure 15.3 Connection Example of SWD Interface (20-Pin Half-Pitch without Trace) ........................................... 52
Figure 15.4 Connection Example of JTAG Interface (20-Pin Full-Pitch) .................................................................. 53
Figure 16.1 Implementation Flow .............................................................................................................................. 54
Figure 16.2 Infrared Reflow Temperature Profile ...................................................................................................... 54
Figure 17.1 Package Information (23 mm Square BGA Package) ............................................................................. 55
Figure 17.2 Package Information (17 mm Square BGA Package) ............................................................................. 56
Figure 18.1 Mount Pad Sizes (23 mm Square BGA Package) ................................................................................... 57
Figure 18.2 Mount Pad Sizes (17 mm Square BGA Package) ................................................................................... 57
Figure 21.1 R-IN32M4-CL3 Marking Information (23 mm Square BGA Package) ................................................. 60
Figure 21.2 R-IN32M4-CL3 Marking Information (17 mm Square BGA Package) ................................................. 60
Contents-5
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