Examples Of Measures For Heat Dissipation - Renesas R-IN32M4-CL3 User Manual

R-IN32M4-CL3 User's Manual: Board design edition
8.2

Examples of Measures for Heat Dissipation

We classify measures for heat dissipation into two types. For details, see the following pages.
(1) Measures for heat release in designing the board
 Take these types of measures into consideration when designing the board.
 The following measures are highly effective, so implement them as a matter of course.
(I) Thermal vias
(II) VDD/GND pattern
(III) Increase the number of board layers, and bring the GND pattern out to the surface layer.
(IV) Consider other factors of placement that will affect heat flows and take the appropriate action.
(2) Heat dissipation from the periphery (including the casing)
 If the measures listed in (1) above still don't achieve your criterion for Δt or satisfy the condition Tj = 125°C or
below, further measures for heat dissipation in the form of heat sinks or heat dissipating gels should be applied,
including for the casing as a whole if this is required.
Notes 1. If increasing the number of layers in the board is difficult, bring the GND pattern out to the
surface layer and make as many via connections between the GND patterns in different
layers as are possible.
2. Take special care in placement in terms of the regulator, since this operates at particularly
high temperatures.
R18UZ0074EJ0100
Dec 24, 2019
8. Thermal Design
Note1
Note2
Page 27 of 61