Renesas R-IN32M3 User Manual
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Renesas R-IN32M3 User Manual

Renesas R-IN32M3 User Manual

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R-IN32M3 Module (RY9012A0)
16
RENESAS MCU
R-IN32M3-EC
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
www.renesas.com
User's Manual: Hardware
Rev.1.00 June 2020
Rev .1.00
June 2020

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Summary of Contents for Renesas R-IN32M3

  • Page 1 All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
  • Page 2 Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
  • Page 3 Products The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
  • Page 4 The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to the text of the manual for details. The following documents apply to the R-IN32M3 Module. Make sure to refer to the latest versions of these documents. Last four digits of document number (described as ****) indicate version information of each document.
  • Page 5 2. Notation of Numbers and Symbols Note: explanation of (Note) in the text Caution: Item deserving extra attention Remark: Supplementary explanation to the text...
  • Page 6 3. List of Abbreviations and Acronyms Abbreviation Full Form Application Programming Interface Common Industrial Protocol Central Processing Unit Electromagnetic Compatibility Frame Ground Hi-Z High Impedance Input / Output P. C. B Print Circuit Board Resistor-Capacitor Serial Peripheral Interface...

  • Page 7: Table Of Contents

    Table of Contents 1. Overview ........................9 Features ..............................9 1.1.1 Applications ............................ 9 Functions..............................9 Product Description ..........................10 1.3.1 Product Name ..........................10 1.3.2 Ordering Information ........................10 2. Host Interface ......................11 Overview ..............................11 Module Pins ............................12 SPI Specification ............................
  • Page 8 7. Packing Specifications ....................33 RY9012A0000GZ00#001 (30-piece tray package) ................33 RY9012A0000GZ00#002 (1-piece sample package) ................34 8. Applicable Standards ....................35 CE Marking ............................. 35 8.1.1 EMC ............................... 35 8.1.2 RoHS/REACH ..........................35 UL ................................35 International Protection Code (IP Code) ....................35 9.

  • Page 9: Overview

    • Embedded dual-port Ethernet switch for bus and ring network topologies • High speed SPI interface and power pins to connect the R-IN32M3 Module to a host CPU • Integrated processor to handle real-time industrial Ethernet protocols R19UH0111ED0100 Rev.1.00...

  • Page 10: Product Description

    R-IN32M3 Module Overview Product Description Product Name 1.3.1 Figure 1.1 Product Name Ordering Information 1.3.2 Table 1.1 Order Information Part No. Application RY9012A0000GZ00#001 Dual-port Ethernet modules in a 30-piece tray package RY9012A0000GZ00#002 Dual port Ethernet modules in a 1-piece sample package...

  • Page 11: Host Interface

    Host Interface Overview The R-IN32M3 Module operates with a 3.3-V power supply and supports SPI communications. The R-IN32M3 Module is shown in outline as a block diagram below. Figure 2.1 R-IN32M3 Module Block Diagram R19UH0111ED0100 Rev.1.00 Page 11 of 41...

  • Page 12: Module Pins

    R-IN32M3 Module Host Interface Module Pins The R-IN32M3 Module pins are for the interface with the power supply, the SPI, which is a slave interface, applying a reset, and clock signals. Table 2.1 Pin Description Signal Description 3.3V ±0.15V DC power supply...
  • Page 13 R-IN32M3 Module Host Interface /SS, MOSI, SCLK MISO, SYNC0, SYNC1 R=22Ω R=22Ω R-IN32M3 R-IN32M3 RESET 3.3V R=51kΩ D=1PS79SB30 R-IN32M3 C=6200pF Figure 2.3 R-IN32M3 Module Internal Circuits R19UH0111ED0100 Rev.1.00 Page 13 of 41 June 30, 2020...

  • Page 14: Spi Specification

    Host Interface SPI Specification The R-IN32M3 Module offers a serial peripheral interface which is supported on the R- IN32M3-EC controller. This communication interface uses 4 signal lines which are connected on 9-pin male connector with 1.27-mm pitch as shown in Table 2.2.
  • Page 15 R-IN32M3 Module Host Interface Table 2.3 SPI Specifications (Vcc = 3.3±0.15 V, Ta = -40 to +70°C) Min. Max. Parameter Symbol Conditions Unit SCLK input cycle tCSISSCK SCLK output high level width tWSKH tCSIMSCK × 0.5 - 5.0 SCLK output low level width tWSKL tCSIMSCK ×...

  • Page 16: Control Reset

    10 ms is required until the power supply voltage becomes stable, after which the /RESET signal can be de-asserted. The /RESET signal must be at the active level for at least 1 μs in order for the R-IN32M3 Module to properly recognize a reset. Figure 2.5 Reset Signal Timing Chart The states of each of the pins during a reset are as follows.

  • Page 17: Sequence Of Supplying And Cutting Off Power

    Host Interface Sequence of Supplying and Cutting off Power The recommended sequence of supplying and cutting off power to the R-IN32M3 Module is shown in the following figure. Wait at least 10 ms after the power supply voltage has become stable before de-asserting the reset signal. 3.3 V must only be applied to the I/O pins after applying the power supply voltages.

  • Page 18: Network Interface Specification

    Network Interface Specification Network Interface Specification Overview With two RJ45 network connectors, the R-IN32M3 Module is ready for external connection in several network topologies. The internal PHY layers in the R-IN32M3-EC can handle different industrial communications protocols and support 10BASE-T and 100BASE-TX/FX.

  • Page 19: Led Status Specification

    R-IN32M3 Module Network Interface Specification LED Status Specification The R-IN32M3 Module has two RJ45 Ethernet ports and two LEDs per RJ45 jack. Therefore, this section describes four LEDs. Figure 3.2 Link and Activity LEDs Table 3.2 LED Location/Function Port Signal...

  • Page 20: Electrical Characteristics

    Electrical Characteristics Electrical Characteristics Absolute Maximum Ratings Stress exceeding the maximum ratings even for short time may damage the R-IN32M3 Module. Functional operation above the recommended operating conditions is not guaranteed. Extended exposure to stress above the recommended operating conditions may affect device reliability.

  • Page 21: Operating Conditions

    All further specifications and statements of timing assume the application of the above- mentioned operating conditions. Functional Earth and Shielding The shield of R-IN32M3 Module is internally connected with GND via a RC-combination. Connect the shield to the frame ground (FG) for electrical testing to obtain CE marking. Shock and Vibration Vibration Test 4.4.1...

  • Page 22: Guideline

    Figure 5.1 Connection to a Host CPU Power Supply 5.2.2 The supply voltage for the R-IN32M3 Module is specified with 3.3V DC ± 0.15V DC (3.15 V to 3.45 V). Since the R-IN32M3 Module has a maximum power consumption of about 2.0 W, it is recommended that the external power be capable of supplying 1.0 A (or more).

  • Page 23: Reset Circuit Example

    RAM capacity: More than 128 KB SPI packet transfer size: 128 bytes (8 bits x 128 times) bulk data transfer Note: When using a Renesas CPU, select the Simple SPI (SCI), as the maximum batch data transfer amount of RSPI is 32 bytes. R19UH0111ED0100 Rev.1.00...

  • Page 24: Industrial Ethernet Protocol Indication

    In addition, the recommended method for controlling each LED is defined in each communications standard. Therefore, the host CPU that processed the data via the R-IN32M3 Module needs to control multiple LEDs. Major protocol status conditions are listed in the following Table 5.1.

  • Page 25: Profinet

    LEDs from the R-IN32M3 Module via SPI protocol. LED_MT_OUT and LED_READY_OUT, and LEDs in the R-IN32M3 Module apply and are controlled by the R- IN32M3 Module. Details are listed in the following table. In addition, Figure 12 shows an example of PROFINET LED connections.
  • Page 26 R-IN32M3 Module Guideline Figure 5.3 Example of PROFINET LED Connections R19UH0111ED0100 Rev.1.00 Page 26 of 41 June 30, 2020...

  • Page 27: Ethernet/Ip

    MS (module status indicator) and NS (network status indicator). Both indicators must be implemented separately from the R-IN32M3 Module and controlled by the application controller. The host controller can obtain information to control the LED from the R-IN32M3 Module via SPI protocol.
  • Page 28 R-IN32M3 Module Guideline Table 5.4 Network Status Indicator Indicator Summary Requirement State Steady off Not powered, no IP Power to the device is off or is on but no IP address address has been configured (Interface Configuration attribute of the TCP/IP Interface Object).
  • Page 29 R-IN32M3 Module Guideline Figure 5.4 Example of EtherNet/IP LED Connections R19UH0111ED0100 Rev.1.00 Page 29 of 41 June 30, 2020...

  • Page 30: Layout Design Guideline

    Guideline 5.4 Layout Design Guideline The following figure shows the footprints needed to implement the R-IN32M3 Module. Gray areas indicate through holes and red areas indicate land patterns. The R-IN32M3 Module mounting surface should be solid ground except in the wiring lead-out parts. No restrictions apply to the inner layers of the P.C.B.

  • Page 31: Mounting Conditions

    R-IN32M3 Module Mounting Conditions Mounting Conditions 6.1 Recommended Soldering Condition (Through Holes) Wave Soldering 6.1.1 The recommended temperature profile by wave soldering is shown below. Maximum temperature (solder temperature): 260°C or below Time at maximum temperature: 10 sec. or less Preheating temperature: 140°C or below...

  • Page 32: Storage Conditions Of The Products Without Moisture-Proof Packing

    R-IN32M3 Module Mounting Conditions 6.2 Storage Conditions of the Products without Moisture-Proof Packing In storage and handling of devices not in the moisture-proof packing, keep them under the following conditions taking solderability, lead corrosion, electrical characteristics and so on into consideration.

  • Page 33: Packing Specifications

    R-IN32M3 Module Packing Specifications Packing Specifications 7.1 RY9012A0000GZ00#001 (30-piece tray package) Put the bag in an inner box. Attach a label on the side of an inner box. Table 7.1 Packing Materials for 30-Piece Tray Package Part Name Materials Tray lid...

  • Page 34: Ry9012A0000Gz00#002 (1-Piece Sample Package)

    R-IN32M3 Module Packing Specifications RY9012A0000GZ00#002 (1-piece sample package) Attach a label on the side of an inner box. Table 7.2 Packing Materials for 1-Piece Sample Package Part Name Materials Inner box (1 piece) Cardboard Grid-shaped Cardboard supporter Cushioning Closed cell polyethylene...

  • Page 35: Applicable Standards

    • RENESAS ELECTRONICS GREENPROCUREMENT GUIDELINE https://www.renesas.com/ja-jp/media/about/company/csr/green/guideline-en.pdf • Management according to the chemical substance list in Renesas Electronics Cooperation The R-IN32M3 Module is a UL-recognized component. International Protection Code (IP Code) The R-IN32M3 Module supports the protection class IP-20. R19UH0111ED0100 Rev.1.00...

  • Page 36: Mechanical Specifications

    R-IN32M3 Module Mechanical Specifications Mechanical Specifications 9.1 Package Dimensions Figure 9.1 Package Dimensions R19UH0111ED0100 Rev.1.00 Page 36 of 41 June 30, 2020...

  • Page 37: Dimensions

    R-IN32M3 Module Mechanical Specifications 9.2 Dimensions The dimensions of each part of R-IN32M3 Module are as follows. Table 9.1 Dimensions of Main Unit Typical Value Tolerance Width [mm] 33.25 ±0.05 Depth [mm] 51.15 ±0.05 Height [mm] 11.12 ±0.05 Excluding protrusions on...

  • Page 38: Marking Specifications

    R-IN32M3 Module Marking Specifications Marking Specifications 10.1 Product Label Image of Product Label Position of Product Label Figure 10.1 Product Label Logo: RENESAS LOGO Model: RY9012A0000GZ00 MAC Address: XXXX XXXX XXXX Country name of origin: Germany Year/Week Code: YY/WW CE mark:...
  • Page 39 R-IN32M3 Module Marking Specifications R19UH0111ED0100 Rev.1.00 Page 39 of 41 June 30, 2020...
  • Page 40 R-IN32M3 Module User’s Manual: Hardware Revision History Rev. Date Description Page Summary ⎯ 1.00 June 30, 2020 First edition issued R19UH0111ED0100 Rev.1.00 Page 39 of 41 June 30, 2020...
  • Page 41 R-IN32M3 Module User’s Manual: Hardware Publication Date: Rev.1.00 June 30, 2020 Published by: Renesas Electronics Corporation...
  • Page 42 R-IN32M3 Module R19UH0111ED0100...

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