Hardware Specifications - Nexcom DFA1163 User Manual

Chapter 1: Product Introduction

Hardware Specifications

Main Board
▪ Intel Atom® processor C3000R
- Intel Atom® processor C3558R, BGA type, 4 cores/
2.4 GHz for DFA 1163
- Intel Atom® processor C3758R, BGA type, 8 cores/
2.4 GHz for DFA 1163A
- Intel Atom® processor C3758R, BGA type, 8 cores/
2.4 GHz for DFA 1163M
▪ TPM 2.0 onboard
Main Memory
▪ 2 x DDR4-2400 ECC RDIMM/UDIMM, up to 64GB
Storage
▪ 1 x 8G onboard eMMC
▪ 1 x PCIe3x 4 M.2 2280 Key M SSD
Interface External
▪ Button: power and reset
▪ LAN ports LED indicators: active/link speed
▪ 8 x LED indicators: power/PoE/MGMT/SSD/WLAN/5G LTE
▪ 1 x USB 3.0 connector combined with RJ45 console port
▪ 1 x USB 3.0 connector combined with RJ45 management port
▪ 1 x Dual Micro SIM slot
▪ 2 x 2.5GbE RJ45 ports ports (with optional PoE+ support)
▪ 2 x 1GbE RJ45 ports ports (with optional PoE+ support)
▪ 8 x 1GbE RJ45 Switch ports (with optional PoE+ support)
▪ 1 x 1GbE SFP port
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▪ 1 x 10GbE SFP+ port
▪ 2 x Fixed smart fans
▪ 2 x Power inlets (1 x 12V, 1 x 54V)
▪ 6 x Antenna holes (4 x for 4G LTE/5G antennas, 2 x for Wi-Fi 6 antennas)
Interface-Internal
▪ 1 x M.2 3080 Key M slot for Wi-Fi 6 module
▪ 1 x M.2 3042/3052 Key B slot for 4G LTE/5G module
Power Input
▪ 65W 12V AC power adapter
▪ 280W 54V PoE power adapter (optional)
Dimensions and Weight
▪ Chassis dimension (mm): 253.5mm x 226mm x 44mm (W x D x H)
▪ Package dimension (mm): 380mm x 320mm x 232mm (W x D x H)
▪ Without package: 3.81 kg
▪ With package: 4.98 kg
Environment
▪ Operating temperature: 0°C~40°C
▪ Storage temperature: -20°C~80°C
▪ Relative humidity: 10%~90% non-condensing
Certifications
▪ CE/FCC Class B
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DFA1163 User Manual